Abstract
This paper describes an ultrasonic experimental test bed system that was designed as a versatile tool for the inspection and classification of adhesive bonding problems. A sample problem, the prediction of adhesive and cohesive defects in aluminum to aluminum step-lap specimens, was solved using this test bed system.
| Original language | English (US) |
|---|---|
| Specialist publication | Solid State Technology |
| State | Published - Jan 1 1979 |
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Electrical and Electronic Engineering
- Materials Chemistry