Generation of deep levels in silicon under posthydrogen-plasma thermal anneal

C. W. Nam, S. Ashok

Research output: Contribution to journalArticlepeer-review

9 Scopus citations


Si wafers subject to short-time (4-12 min), low-temperature atomic hydrogen cleaning in an electron-cyclotron-resonance plasma system have been annealed subsequently in the temperature range 300-750°C for 20 min. While only a small broad peak is discernible immediately after hydrogenation, several pronounced and distinct majority-carrier trap levels appear in deep-level transient spectroscopy measurements of subsequently fabricated Schottky diodes on both n- and p-type Si samples annealed at 450°C and above. The concentrations peak at anneal temperatures around 500°C and drop substantially beyond 750°C. This phenomenon appears to be unrelated to the presence of oxygen in Si and is of potential importance in silicon processing technology.

Original languageEnglish (US)
Pages (from-to)2819-2821
Number of pages3
JournalJournal of Applied Physics
Issue number6
StatePublished - 1995

All Science Journal Classification (ASJC) codes

  • General Physics and Astronomy


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