Glass-Based IC-Embedded Antenna-Integrated Packages for 28-GHz High-Speed Data Communications

Atom O. Watanabe, Muhammad Ali, Rui Zhang, Siddharth Ravichandran, Takenori Kakutani, P. Markondeya Raj, Rao R. Tummala, Madhavan Swaminathan

Research output: Chapter in Book/Report/Conference proceedingConference contribution

30 Scopus citations

Abstract

Chip-embedded mm-wave antenna-integrated modules are demonstrated, for the first time, on panel-scale ultra-thin glass substrates, for high-speed 5G communication standards in the n257 band (26.5 - 29.5 GHz) defined by 3GPP. Co-packaging of amplifiers, filters, and antennas with minimal package parasitics is the key to realize mm-wave package systems. Parasitics arise from on-package and chip-to-package interconnects. This paper focuses on reduced chip-to-package losses and implementation of filters and antennas with chip-embedding structures in glass substrates. To demonstrate the benefits of glass-panel embedding (GPE) for 5G communications, the interconnect losses are benchmarked with the C4-bump based flip-chip technique. The electrical performance shows that the chip-embedding structure with a glass substrate lead to 3X lower insertion loss from chip to antenna than the flip-chip assembly method with C4 bumps. This reduced chip-to-antenna insertion loss brings about the enhanced efficiency and gain of the patch antennas integrated on top of the glass substrates. The process development and electrical performance are benchmarked with emerging 5G substrate technologies such as fan-out wafer level packaging.

Original languageEnglish (US)
Title of host publicationProceedings - IEEE 70th Electronic Components and Technology Conference, ECTC 2020
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages89-94
Number of pages6
ISBN (Electronic)9781728161808
DOIs
StatePublished - Jun 2020
Event70th IEEE Electronic Components and Technology Conference, ECTC 2020 - Orlando, United States
Duration: Jun 3 2020Jun 30 2020

Publication series

NameProceedings - Electronic Components and Technology Conference
Volume2020-June
ISSN (Print)0569-5503

Conference

Conference70th IEEE Electronic Components and Technology Conference, ECTC 2020
Country/TerritoryUnited States
CityOrlando
Period6/3/206/30/20

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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