Guidelines for reduced-order thermal modeling of multifinger GaN HEMTs

Engineering & Materials Science

• Analytical models 30%
• Bias currents 23%
• Composite materials 21%
• Electronic equipment 15%
• Gallium nitride 100%
• Heat flux 16%
• Heat generation 40%
• Heating 13%
• High electron mobility transistors 83%
• Hot Temperature 34%
• Materials properties 15%
• Numerical models 29%
• Power amplifiers 17%
• Temperature 29%
• Temperature control 17%
• Thermodynamic properties 16%

Chemical Compounds

• Composite Material 24%
• Electron Mobility 57%
• Heat 53%
• Nitride 70%
• Thermometry 35%