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Heat transfer in fiber/resin systems for resin transfer molding
Renata S. Engel
, Dennis Butier
The Pennsylvania State University
Engineering Science and Mechanics
Research output
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Contribution to journal
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Conference article
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peer-review
Overview
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Dive into the research topics of 'Heat transfer in fiber/resin systems for resin transfer molding'. Together they form a unique fingerprint.
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Keyphrases
Heat Transfer
100%
Electrical Resistance
100%
Resin System
100%
Resin Transfer Molding
100%
Fiber Bundle
100%
Temperature Variation
50%
Specific Heat
50%
Heat Transfer Coefficient
50%
Epoxy Resin
50%
Low Current
50%
Fiber Tow
50%
Time Response
50%
Carbon Fiber Bundles
50%
Engineering
Function of Time
100%
Temperature Change
100%
Heat Transfer Coefficient
100%
Temperature Time
100%
Resin Transfer Molding
100%
Material Science
Electrical Resistance
100%
Resin Transfer Molding
100%
Epoxy
50%
Carbon Fiber
50%