@article{70847e9cb89d4cf0b0a43efc2c5a41b3,
title = "High-density solder bump interconnect for MEMS hybrid integration",
abstract = "An ultra high-density hybrid integration for microelectromechanical system (MEMS) mirror chips with several thousand inputs/outputs has been developed. The integration scheme involving flip-chip assembly provides electrical signal to individual mirrors, which is compatible with postprocessing steps of selectively removing the silicon handle and releasing the MEMS mirrors. For the first time, to our knowledge, solder deposition and flip-chip bonding of 3-μm bumps on 5-μm centers of a large array has been demonstrated.",
author = "Nagesh Basavanhally and Daniel Lopez and Vladimir Aksyuk and Dave Ramsey and Eric Bower and Ray Cirelli and E. Ferry and Robert Frahm and Gates, {John II} and Fred Klemens and Warren Lai and Yee Low and William Mansfield and Pai, {Chien Shing} and Rick Papazian and Flavio Pardo and Tom Sorsch and Pat Watson",
note = "Funding Information: Manuscript received October 27, 2006; revised June 11, 2007. This work was supported in part by the Defense Advanced Research Projects Agency under SSC San Diego Contract N66001-04-C-8028. The authors are with Lucent Technologies, Bell Laboratories, Murray Hill, NJ 07974 USA. Color versions of one or more of the figures in this paper are available online at http://ieeexplore.ieee.org. Digital Object Identifier 10.1109/TADVP.2007.906395",
year = "2007",
month = nov,
doi = "10.1109/TADVP.2007.906395",
language = "English (US)",
volume = "30",
pages = "622--628",
journal = "IEEE Transactions on Advanced Packaging",
issn = "1521-3323",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
number = "4",
}