High-density solder bump interconnect for MEMS hybrid integration

Nagesh Basavanhally; Daniel Lopez; Vladimir Aksyuk; Dave Ramsey; Eric Bower; Ray Cirelli; E. Ferry; Robert Frahm; John II Gates; Fred Klemens; Warren Lai; Yee Low; William Mansfield; Chien Shing Pai; Rick Papazian; Flavio Pardo; Tom Sorsch; Pat Watson

doi:10.1109/TADVP.2007.906395

High-density solder bump interconnect for MEMS hybrid integration

Nagesh Basavanhally
, Daniel Lopez
, Vladimir Aksyuk
, Dave Ramsey
, Eric Bower
, Ray Cirelli
, E. Ferry
, Robert Frahm
, John II Gates
, Fred Klemens
, Warren Lai
, Yee Low
, William Mansfield
, Chien Shing Pai
, Rick Papazian
, Flavio Pardo
, Tom Sorsch
, Pat Watson

Research output: Contribution to journal › Article › peer-review

16 Scopus citations

Abstract

An ultra high-density hybrid integration for microelectromechanical system (MEMS) mirror chips with several thousand inputs/outputs has been developed. The integration scheme involving flip-chip assembly provides electrical signal to individual mirrors, which is compatible with postprocessing steps of selectively removing the silicon handle and releasing the MEMS mirrors. For the first time, to our knowledge, solder deposition and flip-chip bonding of 3-μm bumps on 5-μm centers of a large array has been demonstrated.

Original language	English (US)
Pages (from-to)	622-628
Number of pages	7
Journal	IEEE Transactions on Advanced Packaging
Volume	30
Issue number	4
DOIs	https://doi.org/10.1109/TADVP.2007.906395
State	Published - Nov 2007

All Science Journal Classification (ASJC) codes

Electrical and Electronic Engineering

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10.1109/TADVP.2007.906395

Cite this

Basavanhally, N., Lopez, D., Aksyuk, V., Ramsey, D., Bower, E., Cirelli, R., Ferry, E., Frahm, R., Gates, J. II., Klemens, F., Lai, W., Low, Y., Mansfield, W., Pai, C. S., Papazian, R., Pardo, F., Sorsch, T., & Watson, P. (2007). High-density solder bump interconnect for MEMS hybrid integration. IEEE Transactions on Advanced Packaging, 30(4), 622-628. https://doi.org/10.1109/TADVP.2007.906395

@article{70847e9cb89d4cf0b0a43efc2c5a41b3,

title = "High-density solder bump interconnect for MEMS hybrid integration",

abstract = "An ultra high-density hybrid integration for microelectromechanical system (MEMS) mirror chips with several thousand inputs/outputs has been developed. The integration scheme involving flip-chip assembly provides electrical signal to individual mirrors, which is compatible with postprocessing steps of selectively removing the silicon handle and releasing the MEMS mirrors. For the first time, to our knowledge, solder deposition and flip-chip bonding of 3-μm bumps on 5-μm centers of a large array has been demonstrated.",

author = "Nagesh Basavanhally and Daniel Lopez and Vladimir Aksyuk and Dave Ramsey and Eric Bower and Ray Cirelli and E. Ferry and Robert Frahm and Gates, \{John II\} and Fred Klemens and Warren Lai and Yee Low and William Mansfield and Pai, \{Chien Shing\} and Rick Papazian and Flavio Pardo and Tom Sorsch and Pat Watson",

note = "Funding Information: Manuscript received October 27, 2006; revised June 11, 2007. This work was supported in part by the Defense Advanced Research Projects Agency under SSC San Diego Contract N66001-04-C-8028. The authors are with Lucent Technologies, Bell Laboratories, Murray Hill, NJ 07974 USA. Color versions of one or more of the figures in this paper are available online at http://ieeexplore.ieee.org. Digital Object Identifier 10.1109/TADVP.2007.906395",

year = "2007",

month = nov,

doi = "10.1109/TADVP.2007.906395",

language = "English (US)",

volume = "30",

pages = "622--628",

journal = "IEEE Transactions on Advanced Packaging",

issn = "1521-3323",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

number = "4",

}

Basavanhally, N, Lopez, D, Aksyuk, V, Ramsey, D, Bower, E, Cirelli, R, Ferry, E, Frahm, R, Gates, JII, Klemens, F, Lai, W, Low, Y, Mansfield, W, Pai, CS, Papazian, R, Pardo, F, Sorsch, T & Watson, P 2007, 'High-density solder bump interconnect for MEMS hybrid integration', IEEE Transactions on Advanced Packaging, vol. 30, no. 4, pp. 622-628. https://doi.org/10.1109/TADVP.2007.906395

TY - JOUR

T1 - High-density solder bump interconnect for MEMS hybrid integration

AU - Basavanhally, Nagesh

AU - Lopez, Daniel

AU - Aksyuk, Vladimir

AU - Ramsey, Dave

AU - Bower, Eric

AU - Cirelli, Ray

AU - Ferry, E.

AU - Frahm, Robert

AU - Gates, John II

AU - Klemens, Fred

AU - Lai, Warren

AU - Low, Yee

AU - Mansfield, William

AU - Pai, Chien Shing

AU - Papazian, Rick

AU - Pardo, Flavio

AU - Sorsch, Tom

AU - Watson, Pat

N1 - Funding Information: Manuscript received October 27, 2006; revised June 11, 2007. This work was supported in part by the Defense Advanced Research Projects Agency under SSC San Diego Contract N66001-04-C-8028. The authors are with Lucent Technologies, Bell Laboratories, Murray Hill, NJ 07974 USA. Color versions of one or more of the figures in this paper are available online at http://ieeexplore.ieee.org. Digital Object Identifier 10.1109/TADVP.2007.906395

PY - 2007/11

Y1 - 2007/11

N2 - An ultra high-density hybrid integration for microelectromechanical system (MEMS) mirror chips with several thousand inputs/outputs has been developed. The integration scheme involving flip-chip assembly provides electrical signal to individual mirrors, which is compatible with postprocessing steps of selectively removing the silicon handle and releasing the MEMS mirrors. For the first time, to our knowledge, solder deposition and flip-chip bonding of 3-μm bumps on 5-μm centers of a large array has been demonstrated.

AB - An ultra high-density hybrid integration for microelectromechanical system (MEMS) mirror chips with several thousand inputs/outputs has been developed. The integration scheme involving flip-chip assembly provides electrical signal to individual mirrors, which is compatible with postprocessing steps of selectively removing the silicon handle and releasing the MEMS mirrors. For the first time, to our knowledge, solder deposition and flip-chip bonding of 3-μm bumps on 5-μm centers of a large array has been demonstrated.

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JO - IEEE Transactions on Advanced Packaging

JF - IEEE Transactions on Advanced Packaging

IS - 4

ER -

High-density solder bump interconnect for MEMS hybrid integration

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