Abstract
Materials and fabrication approaches that allow integration of biodegradable/transient electronics onto diverse classes of biodegradable substrates are presented in this article. By first depositing, patterning, and etching the materials for the electronics and then integrating them on a substrate of interest, it is possible to use nearly any type of biodegradable material for this purpose. Component and system-level studies of various devices and biodegradable polymers illustrate the capabilities and operational aspects. Dissolution studies and mechanics modeling results highlight different modes for transient behavior.
Original language | English (US) |
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Pages (from-to) | 3905-3911 |
Number of pages | 7 |
Journal | Advanced Materials |
Volume | 26 |
Issue number | 23 |
DOIs | |
State | Published - Jun 18 2014 |
All Science Journal Classification (ASJC) codes
- General Materials Science
- Mechanics of Materials
- Mechanical Engineering