TY - JOUR
T1 - High-Performance Polymers Sandwiched with Chemical Vapor Deposited Hexagonal Boron Nitrides as Scalable High-Temperature Dielectric Materials
AU - Azizi, Amin
AU - Gadinski, Matthew R.
AU - Li, Qi
AU - AlSaud, Mohammed Abu
AU - Wang, Jianjun
AU - Wang, Yi
AU - Wang, Bo
AU - Liu, Feihua
AU - Chen, Long Qing
AU - Alem, Nasim
AU - Wang, Qing
N1 - Funding Information:
The work was supported by the US Office of Naval Research (QW) and the National Science Foundation (LC). NA, AA, and MA acknowledge the Center for 2D Layered Materials (2DLM) at the Pennsylvania State University and support from the NSF under EFRI 2-DARE Grant 1433378.
Publisher Copyright:
© 2017 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim
PY - 2017/9/20
Y1 - 2017/9/20
N2 - Polymer dielectrics are the preferred materials of choice for power electronics and pulsed power applications. However, their relatively low operating temperatures significantly limit their uses in harsh-environment energy storage devices, e.g., automobile and aerospace power systems. Herein, hexagonal boron nitride (h-BN) films are prepared from chemical vapor deposition (CVD) and readily transferred onto polyetherimide (PEI) films. Greatly improved performance in terms of discharged energy density and charge–discharge efficiency is achieved in the PEI sandwiched with CVD-grown h-BN films at elevated temperatures when compared to neat PEI films and other high-temperature polymer and nanocomposite dielectrics. Notably, the h-BN-coated PEI films are capable of operating with >90% charge–discharge efficiencies and delivering high energy densities, i.e., 1.2 J cm−3, even at a temperature close to the glass transition temperature of polymer (i.e., 217 °C) where pristine PEI almost fails. Outstanding cyclability and dielectric stability over a straight 55 000 charge–discharge cycles are demonstrated in the h-BN-coated PEI at high temperatures. The work demonstrates a general and scalable pathway to enable the high-temperature capacitive energy applications of a wide range of engineering polymers and also offers an efficient method for the synthesis and transfer of 2D nanomaterials at the scale demanded for applications.
AB - Polymer dielectrics are the preferred materials of choice for power electronics and pulsed power applications. However, their relatively low operating temperatures significantly limit their uses in harsh-environment energy storage devices, e.g., automobile and aerospace power systems. Herein, hexagonal boron nitride (h-BN) films are prepared from chemical vapor deposition (CVD) and readily transferred onto polyetherimide (PEI) films. Greatly improved performance in terms of discharged energy density and charge–discharge efficiency is achieved in the PEI sandwiched with CVD-grown h-BN films at elevated temperatures when compared to neat PEI films and other high-temperature polymer and nanocomposite dielectrics. Notably, the h-BN-coated PEI films are capable of operating with >90% charge–discharge efficiencies and delivering high energy densities, i.e., 1.2 J cm−3, even at a temperature close to the glass transition temperature of polymer (i.e., 217 °C) where pristine PEI almost fails. Outstanding cyclability and dielectric stability over a straight 55 000 charge–discharge cycles are demonstrated in the h-BN-coated PEI at high temperatures. The work demonstrates a general and scalable pathway to enable the high-temperature capacitive energy applications of a wide range of engineering polymers and also offers an efficient method for the synthesis and transfer of 2D nanomaterials at the scale demanded for applications.
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U2 - 10.1002/adma.201701864
DO - 10.1002/adma.201701864
M3 - Article
C2 - 28714119
AN - SCOPUS:85024089552
SN - 0935-9648
VL - 29
JO - Advanced Materials
JF - Advanced Materials
IS - 35
M1 - 1701864
ER -