High resolution and low-cost test technique for unpopulated MCM substrate

This paper describes a novel and low-cost technique for detecting process-related interconnect faults in Multichip Modules (MCMs). This method is an alternative to existing test methods such as TDNA, electron beam, electrical module test (EMT) and capacitance techniques which are either expensive in terms of test equipment, are cumbersome due to the requirement of multiple probes, or provide poor fault coverage. The new technique applies a stimulus through a resonator and a single ended probe at one end of the interconnect. By measuring the attenuation of the test stimulus due to pole movement relative to known attenuation measurements, interconnect faults such as latent opens, latent shorts, opens, and shorts can be detected.