Hydrogen and processing damage in CMOS device reliability: defect passivation and depassivation during plasma exposures and subsequent annealing

O. O. Awadelkarim, S. J. Fonash, P. I. Mikulan, M. Ozaita, Y. D. Chan

Research output: Contribution to journalArticlepeer-review

17 Scopus citations

Abstract

The interactions of hydrogen with plasma-charging induced defects have been examined using 0.5 μm n-channel LDD MOSFETs fabricated on p-type Si by employing Cl2/HBr-based chemistries and CHF3/CF4-based chemistries polycrystalline Si gate definition and contact etch, respectively. New experimental results are presented which provide evidence for the passivation and depassivation of defects in the gate oxide and at the oxide/Si interface by hydrogen.

Original languageEnglish (US)
Pages (from-to)47-50
Number of pages4
JournalMicroelectronic Engineering
Volume28
Issue number1-4
DOIs
StatePublished - Jun 1995

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Condensed Matter Physics
  • Surfaces, Coatings and Films
  • Electrical and Electronic Engineering

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