Abstract
We present evidence linking specific atomic scale defects to leakage currents in thermally grown silicon dioxide thin films on silicon. The defects identified are oxygen deficient silicon `dangling bond' centers. These centers have been identified through electron spin resonance measurements. We find a strong correspondence between the generation of an oxygen deficient silicon dangling bond defect in the oxide and the appearance of oxide leakage currents. We observe a strong correlation between the disappearance of these centers and the disappearance of leakage currents in relatively low temperature anneals (200 °C) in air.
Original language | English (US) |
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Pages | 112-115 |
Number of pages | 4 |
State | Published - Dec 1 2000 |
Event | 2000 IEEE International Integrated Reliability Workshop - Lake Tahoe, CA, USA Duration: Oct 23 2000 → Oct 26 2000 |
Other
Other | 2000 IEEE International Integrated Reliability Workshop |
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City | Lake Tahoe, CA, USA |
Period | 10/23/00 → 10/26/00 |
All Science Journal Classification (ASJC) codes
- Electrical and Electronic Engineering
- Industrial and Manufacturing Engineering