Impact of process variations on carbon nanotube bundle interconnect for future FPGA architectures

S. Eachempati; N. Vijaykrishnan; Arthur Nieuwoudt; Yehia Massoud

doi:10.1109/ISVLSI.2007.56

Impact of process variations on carbon nanotube bundle interconnect for future FPGA architectures

S. Eachempati, N. Vijaykrishnan, Arthur Nieuwoudt, Yehia Massoud

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

2 Scopus citations

Abstract

As CMOS technology continues to scale, copper interconnect (CuI) will hinder the performance and reliability of Field Programmable Gate Arrays (FPGA) motivating the need for alternative interconnect solutions for future process technologies. In this paper, we investigate the impact of statistical variations in interconnect properties on FPGA timing yield (TY) when bundles of single-walled carbon nanotubes (SWCNT) are used as interconnect in the FPGA routing fabric. The results indicate that SWCNT bundle-based interconnect (SWCNTBI) can provide a superior performance-yield trade-off over FPGAs implemented using traditional CuI in future process technologies.

Original language	English (US)
Title of host publication	Proceedings - IEEE Computer Society Annual Symposium on VLSI
Subtitle of host publication	Emerging VLSI Technologies and Architectures
Pages	516-517
Number of pages	2
DOIs	https://doi.org/10.1109/ISVLSI.2007.56
State	Published - 2007
Event	IEEE Computer Society Annual Symposium on VLSI: Emerging VLSI Technologies and Architectures, ISVLSI'07 - Porto Alegre, Brazil Duration: Mar 9 2007 → Mar 11 2007

Publication series

Name	Proceedings - IEEE Computer Society Annual Symposium on VLSI: Emerging VLSI Technologies and Architectures

Other

Other	IEEE Computer Society Annual Symposium on VLSI: Emerging VLSI Technologies and Architectures, ISVLSI'07
Country/Territory	Brazil
City	Porto Alegre
Period	3/9/07 → 3/11/07

All Science Journal Classification (ASJC) codes

Electrical and Electronic Engineering

Access to Document

10.1109/ISVLSI.2007.56

Cite this

Eachempati, S., Vijaykrishnan, N., Nieuwoudt, A., & Massoud, Y. (2007). Impact of process variations on carbon nanotube bundle interconnect for future FPGA architectures. In Proceedings - IEEE Computer Society Annual Symposium on VLSI: Emerging VLSI Technologies and Architectures (pp. 516-517). Article 4208978 (Proceedings - IEEE Computer Society Annual Symposium on VLSI: Emerging VLSI Technologies and Architectures). https://doi.org/10.1109/ISVLSI.2007.56

Eachempati, S. ; Vijaykrishnan, N. ; Nieuwoudt, Arthur et al. / Impact of process variations on carbon nanotube bundle interconnect for future FPGA architectures. Proceedings - IEEE Computer Society Annual Symposium on VLSI: Emerging VLSI Technologies and Architectures. 2007. pp. 516-517 (Proceedings - IEEE Computer Society Annual Symposium on VLSI: Emerging VLSI Technologies and Architectures).

@inproceedings{3725061a21744f5791f20976a38eed38,

title = "Impact of process variations on carbon nanotube bundle interconnect for future FPGA architectures",

abstract = "As CMOS technology continues to scale, copper interconnect (CuI) will hinder the performance and reliability of Field Programmable Gate Arrays (FPGA) motivating the need for alternative interconnect solutions for future process technologies. In this paper, we investigate the impact of statistical variations in interconnect properties on FPGA timing yield (TY) when bundles of single-walled carbon nanotubes (SWCNT) are used as interconnect in the FPGA routing fabric. The results indicate that SWCNT bundle-based interconnect (SWCNTBI) can provide a superior performance-yield trade-off over FPGAs implemented using traditional CuI in future process technologies.",

author = "S. Eachempati and N. Vijaykrishnan and Arthur Nieuwoudt and Yehia Massoud",

year = "2007",

doi = "10.1109/ISVLSI.2007.56",

language = "English (US)",

isbn = "0769528961",

series = "Proceedings - IEEE Computer Society Annual Symposium on VLSI: Emerging VLSI Technologies and Architectures",

pages = "516--517",

booktitle = "Proceedings - IEEE Computer Society Annual Symposium on VLSI",

note = "IEEE Computer Society Annual Symposium on VLSI: Emerging VLSI Technologies and Architectures, ISVLSI'07 ; Conference date: 09-03-2007 Through 11-03-2007",

}

Eachempati, S, Vijaykrishnan, N, Nieuwoudt, A & Massoud, Y 2007, Impact of process variations on carbon nanotube bundle interconnect for future FPGA architectures. in Proceedings - IEEE Computer Society Annual Symposium on VLSI: Emerging VLSI Technologies and Architectures., 4208978, Proceedings - IEEE Computer Society Annual Symposium on VLSI: Emerging VLSI Technologies and Architectures, pp. 516-517, IEEE Computer Society Annual Symposium on VLSI: Emerging VLSI Technologies and Architectures, ISVLSI'07, Porto Alegre, Brazil, 3/9/07. https://doi.org/10.1109/ISVLSI.2007.56

Impact of process variations on carbon nanotube bundle interconnect for future FPGA architectures. / Eachempati, S.; Vijaykrishnan, N.; Nieuwoudt, Arthur et al.
Proceedings - IEEE Computer Society Annual Symposium on VLSI: Emerging VLSI Technologies and Architectures. 2007. p. 516-517 4208978 (Proceedings - IEEE Computer Society Annual Symposium on VLSI: Emerging VLSI Technologies and Architectures).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

TY - GEN

T1 - Impact of process variations on carbon nanotube bundle interconnect for future FPGA architectures

AU - Eachempati, S.

AU - Vijaykrishnan, N.

AU - Nieuwoudt, Arthur

AU - Massoud, Yehia

PY - 2007

Y1 - 2007

N2 - As CMOS technology continues to scale, copper interconnect (CuI) will hinder the performance and reliability of Field Programmable Gate Arrays (FPGA) motivating the need for alternative interconnect solutions for future process technologies. In this paper, we investigate the impact of statistical variations in interconnect properties on FPGA timing yield (TY) when bundles of single-walled carbon nanotubes (SWCNT) are used as interconnect in the FPGA routing fabric. The results indicate that SWCNT bundle-based interconnect (SWCNTBI) can provide a superior performance-yield trade-off over FPGAs implemented using traditional CuI in future process technologies.

AB - As CMOS technology continues to scale, copper interconnect (CuI) will hinder the performance and reliability of Field Programmable Gate Arrays (FPGA) motivating the need for alternative interconnect solutions for future process technologies. In this paper, we investigate the impact of statistical variations in interconnect properties on FPGA timing yield (TY) when bundles of single-walled carbon nanotubes (SWCNT) are used as interconnect in the FPGA routing fabric. The results indicate that SWCNT bundle-based interconnect (SWCNTBI) can provide a superior performance-yield trade-off over FPGAs implemented using traditional CuI in future process technologies.

UR - http://www.scopus.com/inward/record.url?scp=36348999644&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=36348999644&partnerID=8YFLogxK

U2 - 10.1109/ISVLSI.2007.56

DO - 10.1109/ISVLSI.2007.56

M3 - Conference contribution

AN - SCOPUS:36348999644

SN - 0769528961

SN - 9780769528960

T3 - Proceedings - IEEE Computer Society Annual Symposium on VLSI: Emerging VLSI Technologies and Architectures

SP - 516

EP - 517

BT - Proceedings - IEEE Computer Society Annual Symposium on VLSI

T2 - IEEE Computer Society Annual Symposium on VLSI: Emerging VLSI Technologies and Architectures, ISVLSI'07

Y2 - 9 March 2007 through 11 March 2007

ER -

Eachempati S, Vijaykrishnan N, Nieuwoudt A, Massoud Y. Impact of process variations on carbon nanotube bundle interconnect for future FPGA architectures. In Proceedings - IEEE Computer Society Annual Symposium on VLSI: Emerging VLSI Technologies and Architectures. 2007. p. 516-517. 4208978. (Proceedings - IEEE Computer Society Annual Symposium on VLSI: Emerging VLSI Technologies and Architectures). doi: 10.1109/ISVLSI.2007.56

Impact of process variations on carbon nanotube bundle interconnect for future FPGA architectures

Abstract

Publication series

Other

All Science Journal Classification (ASJC) codes

Access to Document

Other files and links

Cite this