Abstract
The fabrication of a-Si:H photovoltaic (PV) cells on polyimide or other flexible polymeric substrates presents significant challenges compared to cells fabricated on metallized glass or metal substrates. In particular, the low thermal conductivity of polyimide materials, and the difficulty of maintaining flatness, make substrate thermal control problematic. We report here a cell fabrication process on a 2 mil thick polyimide substrate using a pressure-sensitive silicone adhesive to provide thermal contact and to control substrate warping. Results are directly compared with cells similarly fabricated but on conventional substrates.
| Original language | English (US) |
|---|---|
| Pages (from-to) | 699-702 |
| Number of pages | 4 |
| Journal | Conference Record of the IEEE Photovoltaic Specialists Conference |
| State | Published - 1997 |
| Event | Proceedings of the 1997 IEEE 26th Photovoltaic Specialists Conference - Anaheim, CA, USA Duration: Sep 29 1997 → Oct 3 1997 |
All Science Journal Classification (ASJC) codes
- Control and Systems Engineering
- Industrial and Manufacturing Engineering
- Electrical and Electronic Engineering
