Improving Mechanical Durability of SLA-Printed Components for Load-Bearing

This study explored the impact of post-printing parameters in stereolithography (SLA) technology, particularly focusing on how photopolymerization affected the mechanical properties of samples. Building on previous research, the investigation revealed that different curing temperatures significantly influenced the rigidity and stiffness of the printed samples. The mechanical properties of the samples were evaluated through three-point bending tests. Curing at 60 °C left some polymer chains uncured, resulting in less rigid samples but increased load capacity (up to 30 ± 2.4 N) and deflection (2.9 ± 0.6 mm). On the other hand, curing at 70 °C enhanced the rigidity and stiffness, especially for larger samples. The results demonstrated that photopolymerization and the resulting polymer chain cross-linking are crucial for achieving the desired mechanical properties. Notably, as the diameter of the samples decreased, the difference in stiffness between the 60 and 70 °C cured samples also reduced. The findings highlight the importance of optimizing curing temperatures to tailor the mechanical performance of SLA-printed components for specific applications.