In-plane thermal conductance measurement of one-dimensional nanostructures

We present a new analytical model for thermal conductivity measurement of one-dimensional nanostructures on substrates. The model expands the capability of the conventional 3x technique, to make it versatile with both in and out of plane thermal conductivity measurement on specimens either freestanding or attached to substrates. We demonstrate the model on both conducting (aluminum) and semi-conducting (focused ion beam deposited platinum) specimens. The agreement with the established values in the literature suggests the superiority of this technique in terms of convenience and robustness of measurement.