Abstract
For the successful electrical design of system-inpackage, this paper proposes an efficient method for extracting wideband resistance and inductance from a large number of 3-D interconnections. The proposed method uses the modal equivalent network from the electric field integral equation with cylindrical conduction-mode basis function, which reduces the matrix size for large 3-D interconnection problems. Additional enhancement schemes proposed further reduce the cost for computing the partial inductances. Therefore, the method discussed in this paper can be used to construct accurate models of a large number of 3-D interconnection structures such as more than 100 bonding wires used for stacking chips.
Original language | English (US) |
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Pages (from-to) | 846-859 |
Number of pages | 14 |
Journal | IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems |
Volume | 28 |
Issue number | 1 |
State | Published - Jan 2009 |
All Science Journal Classification (ASJC) codes
- Software
- Computer Graphics and Computer-Aided Design
- Electrical and Electronic Engineering