Abstract
Researchers at Applied Research Laboratory-Penn State University used field assisted sintering technology (FAST) to demonstrate the proof-of-concept by fabricating net-shaped heat-sink plates, focusing on development of functional graded heat-sink components and high-current density modules needed for a wide range of applications. Researchers also looked at fabricating heat-sink plates of various other systems such as copper-diamond, copper-tungsten, refractory materials, tungsten, and ceramic materials. The results showed that joining tungsten to copper is difficult due to the high thermal conductivity of copper. Nickel is found to be a good material for the intermediate layer in high temperature electrode applications, which shows that tungsten can be used for high temperature electrode and Cu is used for heat extraction.
Original language | English (US) |
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Pages | 25-28 |
Number of pages | 4 |
Volume | 169 |
No | 8 |
Specialist publication | Advanced Materials and Processes |
State | Published - Aug 1 2011 |
All Science Journal Classification (ASJC) codes
- General Materials Science
- Mechanics of Materials
- Mechanical Engineering