Influence of interleaf deformation behavior and film-resin adhesion on the fracture toughness of interleaved composites

Eileen Armstrong-Carrol, Bassel Iskandarani, Ihab Kamel, Thomas M. Donnellan

Research output: Chapter in Book/Report/Conference proceedingConference contribution

8 Scopus citations


Two-dimensional laminated composite materials are susceptible to damage by interlaminar crack growth. Delaminations severely degrade composite load-carrying capability. Interleaved composites are fabricated with thin films inserted between composite prepreg plies. Previous work has shown that interleaved composites have significantly higher delamination and impact resistance than composites without interleaves. This paper examines interleaving as a technique for the improvement of delamination resistance in composites. In particular, the influence of the deformation behavior of the interleaf film and film adhesion on composite fracture toughness is studied. Teflon and Kapton interleaf film materials are compared. Kapton displays predominantly brittle deformation behavior. Teflon exhibits substantial deformation before failure. Both films are plasma treated to vary film-resin bond strengths. The fracture toughness of composites interleaved with these films is determined. Plasma treatments are shown to increase film-resin adhesion and fracture toughness. The effectiveness of Teflon as an interleaf material may be limited by the toughness of this film. Fracture toughness specimens are found to fail at the film-plasma grafted polymer interface. Additional optimization of the film-grafted polymer bond is necessary for improved performance.

Original languageEnglish (US)
Title of host publicationFatigue and Fracture
PublisherPubl by ASTM
Number of pages19
ISBN (Print)0803114982
StatePublished - Jan 1 1993
Event4th Symposium on Composite Materials - Indianapolis, IN, USA
Duration: May 6 1991May 7 1991

Publication series

NameASTM Special Technical Publication
ISSN (Print)0066-0558


Other4th Symposium on Composite Materials
CityIndianapolis, IN, USA

All Science Journal Classification (ASJC) codes

  • General Engineering


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