Influence of interleaf deformation behavior and film-resin adhesion on the fracture toughness of interleaved composites

Eileen Armstrong-Carrol, Bassel Iskandarani, Ihab Kamel, Thomas M. Donnellan

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    8 Scopus citations

    Abstract

    Two-dimensional laminated composite materials are susceptible to damage by interlaminar crack growth. Delaminations severely degrade composite load-carrying capability. Interleaved composites are fabricated with thin films inserted between composite prepreg plies. Previous work has shown that interleaved composites have significantly higher delamination and impact resistance than composites without interleaves. This paper examines interleaving as a technique for the improvement of delamination resistance in composites. In particular, the influence of the deformation behavior of the interleaf film and film adhesion on composite fracture toughness is studied. Teflon and Kapton interleaf film materials are compared. Kapton displays predominantly brittle deformation behavior. Teflon exhibits substantial deformation before failure. Both films are plasma treated to vary film-resin bond strengths. The fracture toughness of composites interleaved with these films is determined. Plasma treatments are shown to increase film-resin adhesion and fracture toughness. The effectiveness of Teflon as an interleaf material may be limited by the toughness of this film. Fracture toughness specimens are found to fail at the film-plasma grafted polymer interface. Additional optimization of the film-grafted polymer bond is necessary for improved performance.

    Original languageEnglish (US)
    Title of host publicationFatigue and Fracture
    PublisherPubl by ASTM
    Pages299-317
    Number of pages19
    Edition1156
    ISBN (Print)0803114982
    StatePublished - 1993
    Event4th Symposium on Composite Materials - Indianapolis, IN, USA
    Duration: May 6 1991May 7 1991

    Publication series

    NameASTM Special Technical Publication
    Number1156
    ISSN (Print)0066-0558

    Other

    Other4th Symposium on Composite Materials
    CityIndianapolis, IN, USA
    Period5/6/915/7/91

    All Science Journal Classification (ASJC) codes

    • General Engineering

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