TY - GEN
T1 - Integrated Low-Loss Planar Goubau Lines on Glass Interposer for 6G Wireless Applications
AU - Jia, Xiaofan
AU - Swaminathan, Madhavan
N1 - Funding Information:
ACKNOWLEDGMENT This work was supported in part by ASCENT, one of six centers in JUMP, a Semiconductor Research Corporation (SRC) program sponsored by DARPA. This work was supported in part also by the Industry Consortium at the Georgia Tech Packaging Research Center (PRC).
Publisher Copyright:
© 2022 IEEE.
PY - 2022
Y1 - 2022
N2 - This paper presents the design, fabrication, and measurement of low-loss planar Goubau lines (PGL) integrated onto thin glass interposer for D-band (110 GHz - 170 GHz) applications. The core material is 200 μm AGC ENA1 glass with 15 μm Ajinomoto Build-up Films (ABF) GL102 laminated on both sides. CPW-PGL launchers are designed to excite the supported surface wave mode. PGLs with different lengths are fabricated to extract the loss per millimeter. The measured results show around 0.32 dB/mm loss at 140 GHz. The comparison between PGL and other interconnects on glass substrate for D-band application is presented.
AB - This paper presents the design, fabrication, and measurement of low-loss planar Goubau lines (PGL) integrated onto thin glass interposer for D-band (110 GHz - 170 GHz) applications. The core material is 200 μm AGC ENA1 glass with 15 μm Ajinomoto Build-up Films (ABF) GL102 laminated on both sides. CPW-PGL launchers are designed to excite the supported surface wave mode. PGLs with different lengths are fabricated to extract the loss per millimeter. The measured results show around 0.32 dB/mm loss at 140 GHz. The comparison between PGL and other interconnects on glass substrate for D-band application is presented.
UR - https://www.scopus.com/pages/publications/85138007535
UR - https://www.scopus.com/pages/publications/85138007535#tab=citedBy
U2 - 10.1109/IMS37962.2022.9865431
DO - 10.1109/IMS37962.2022.9865431
M3 - Conference contribution
AN - SCOPUS:85138007535
T3 - IEEE MTT-S International Microwave Symposium Digest
SP - 367
EP - 370
BT - 2022 IEEE/MTT-S International Microwave Symposium, IMS 2022
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2022 IEEE/MTT-S International Microwave Symposium, IMS 2022
Y2 - 19 June 2022 through 24 June 2022
ER -