Abstract
Successful implementation of low-cost, reliable, integrated microsystems requires the integration of planar two-dimensional microelectronic circuits with three-dimensional microelectromechanical structures. Over the past several years, many methods for the integration of microcircuits with micromechanical structures have been developed. This review paper will present an overview of these techniques for integrating microelectromechanical structures with microelectronic circuits. The state-of-the-art, limitations and challenges in the realization of such integrated microsystems are discussed.
| Original language | English (US) |
|---|---|
| Title of host publication | Midwest Symposium on Circuits and Systems |
| Pages | 224-227 |
| Number of pages | 4 |
| Volume | 1 |
| State | Published - 2000 |
| Event | 43rd Midwest Circuits and Systems Conference (MWSCAS-2000) - Lansing, MI, United States Duration: Aug 8 2000 → Aug 11 2000 |
Other
| Other | 43rd Midwest Circuits and Systems Conference (MWSCAS-2000) |
|---|---|
| Country/Territory | United States |
| City | Lansing, MI |
| Period | 8/8/00 → 8/11/00 |
All Science Journal Classification (ASJC) codes
- Electrical and Electronic Engineering
- Electronic, Optical and Magnetic Materials