Integration of thin film passive circuits using high/low dielectric constant materials

P. Chahal; A. Haridass; A. Pham; R. R. Tummala; M. G. Allen; M. Swaminathan; J. Laskar

Integration of thin film passive circuits using high/low dielectric constant materials

P. Chahal
, A. Haridass
, A. Pham
, R. R. Tummala
, M. G. Allen
, M. Swaminathan
, J. Laskar

Electrical Engineering

Research output: Contribution to journal › Conference article › peer-review

6 Scopus citations

Abstract

Integration of passives is a continuous challenge towards achieving high performance packages with low profile, improved reliability, maximum packaging efficiency and low cost. This paper discusses the design, fabrication and measurement of integrated passive structures using dielectric constants of 3.3 and 9.1, and thickness in the range of 10-21 μm for wireless applications. The use of polymer-ceramic composite material provide the design flexibility to combine both high dielectric constant and low dielectric constant materials within a single module. This allows for the design of matching networks, RF filters and ability to decouple power supplies for mixed signal applications with reduced size.

Original language	English (US)
Pages (from-to)	739-744
Number of pages	6
Journal	Proceedings - Electronic Components and Technology Conference
State	Published - 1997
Event	Proceedings of the 1997 47th IEEE Electronic Components & Technology Conference - San Jose, CA, USA Duration: May 18 1997 → May 21 1997

All Science Journal Classification (ASJC) codes

Electronic, Optical and Magnetic Materials
Electrical and Electronic Engineering

Cite this

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title = "Integration of thin film passive circuits using high/low dielectric constant materials",

abstract = "Integration of passives is a continuous challenge towards achieving high performance packages with low profile, improved reliability, maximum packaging efficiency and low cost. This paper discusses the design, fabrication and measurement of integrated passive structures using dielectric constants of 3.3 and 9.1, and thickness in the range of 10-21 μm for wireless applications. The use of polymer-ceramic composite material provide the design flexibility to combine both high dielectric constant and low dielectric constant materials within a single module. This allows for the design of matching networks, RF filters and ability to decouple power supplies for mixed signal applications with reduced size.",

author = "P. Chahal and A. Haridass and A. Pham and Tummala, \{R. R.\} and Allen, \{M. G.\} and M. Swaminathan and J. Laskar",

year = "1997",

language = "English (US)",

pages = "739--744",

journal = "Proceedings - Electronic Components and Technology Conference",

issn = "0569-5503",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

note = "Proceedings of the 1997 47th IEEE Electronic Components \& Technology Conference ; Conference date: 18-05-1997 Through 21-05-1997",

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TY - JOUR

T1 - Integration of thin film passive circuits using high/low dielectric constant materials

AU - Chahal, P.

AU - Haridass, A.

AU - Pham, A.

AU - Tummala, R. R.

AU - Allen, M. G.

AU - Swaminathan, M.

AU - Laskar, J.

PY - 1997

Y1 - 1997

N2 - Integration of passives is a continuous challenge towards achieving high performance packages with low profile, improved reliability, maximum packaging efficiency and low cost. This paper discusses the design, fabrication and measurement of integrated passive structures using dielectric constants of 3.3 and 9.1, and thickness in the range of 10-21 μm for wireless applications. The use of polymer-ceramic composite material provide the design flexibility to combine both high dielectric constant and low dielectric constant materials within a single module. This allows for the design of matching networks, RF filters and ability to decouple power supplies for mixed signal applications with reduced size.

AB - Integration of passives is a continuous challenge towards achieving high performance packages with low profile, improved reliability, maximum packaging efficiency and low cost. This paper discusses the design, fabrication and measurement of integrated passive structures using dielectric constants of 3.3 and 9.1, and thickness in the range of 10-21 μm for wireless applications. The use of polymer-ceramic composite material provide the design flexibility to combine both high dielectric constant and low dielectric constant materials within a single module. This allows for the design of matching networks, RF filters and ability to decouple power supplies for mixed signal applications with reduced size.

UR - https://www.scopus.com/pages/publications/0030653550

UR - https://www.scopus.com/pages/publications/0030653550#tab=citedBy

M3 - Conference article

AN - SCOPUS:0030653550

SN - 0569-5503

SP - 739

EP - 744

JO - Proceedings - Electronic Components and Technology Conference

JF - Proceedings - Electronic Components and Technology Conference

T2 - Proceedings of the 1997 47th IEEE Electronic Components & Technology Conference

Y2 - 18 May 1997 through 21 May 1997

ER -

Integration of thin film passive circuits using high/low dielectric constant materials

Abstract

All Science Journal Classification (ASJC) codes

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