Abstract
Intelligent Network Communicator (INC) is proposed in this paper. The system has been defined to show the validity of SOP concept to deal with the high performance, multiple-functional system that will be needed for future electronic products. The function of INC testbed is to transmit and receive the mixed signal, that is the high speed digital and modulated RF signal, through the optical channel. INC system is composed of three blocks: Digital, Analog and Optical block to deal with the mixed signals effectively. To enable the single packaging solution, the various embedded components such as RF filters and power combiner have been developed based on the low cost material and package technologies. The INC system has been fabricated using the multi-layer organic process developed by NSF Packaging Research Center in Georgia Institute of Technology. The measured results of the crosstalk between the high-speed digital channels and the embedded RF components are presented. For the test of the system, 2.5Gbps digital signal and 7 GHz RF signal are combined together at the SOP board and transmitted through the multi-mode fiber after modulated by VCSEL.
Original language | English (US) |
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Pages (from-to) | 1594-1598 |
Number of pages | 5 |
Journal | Proceedings - Electronic Components and Technology Conference |
State | Published - 2003 |
Event | 53rd Electronic Components and Technology Conference 2003 - New Orleans LA, United States Duration: May 27 2003 → May 30 2003 |
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering