Intelligent network communicator: Highly integrated system-on-package (SOP) testbed for RF/digital/opto applications

Kyutae Lim, Mekita F. Davis, Moonkyun Maeng, Stephane Pinel, Lixi Wan, Joy Laskar, Venky Sundaram, George White, Madhavan Swaminathan, Rao Tummala

Research output: Contribution to journalConference articlepeer-review

5 Scopus citations

Abstract

Intelligent Network Communicator (INC) is proposed in this paper. The system has been defined to show the validity of SOP concept to deal with the high performance, multiple-functional system that will be needed for future electronic products. The function of INC testbed is to transmit and receive the mixed signal, that is the high speed digital and modulated RF signal, through the optical channel. INC system is composed of three blocks: Digital, Analog and Optical block to deal with the mixed signals effectively. To enable the single packaging solution, the various embedded components such as RF filters and power combiner have been developed based on the low cost material and package technologies. The INC system has been fabricated using the multi-layer organic process developed by NSF Packaging Research Center in Georgia Institute of Technology. The measured results of the crosstalk between the high-speed digital channels and the embedded RF components are presented. For the test of the system, 2.5Gbps digital signal and 7 GHz RF signal are combined together at the SOP board and transmitted through the multi-mode fiber after modulated by VCSEL.

Original languageEnglish (US)
Pages (from-to)1594-1598
Number of pages5
JournalProceedings - Electronic Components and Technology Conference
StatePublished - 2003
Event53rd Electronic Components and Technology Conference 2003 - New Orleans LA, United States
Duration: May 27 2003May 30 2003

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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