Interfacial reactions and phase stability in the Ni/InP system

Suzanne E. Mohney; Y. Austin Chang

doi:10.1557/proc-337-393

Interfacial reactions and phase stability in the Ni/InP system

Suzanne E. Mohney, Y. Austin Chang

Research output: Contribution to journal › Conference article › peer-review

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Abstract

Nickel is widely used in electrical contacts to InP, especially in NiAuGe ohmic contact to n-type InP. Several researchers have even suggested that the reaction of Ni with InP plays an important role in the ohmic nature of Ni-based contacts. However, numerous discrepancies are found in the literature concerning the Ni/InP reaction. In this study, an examination of the phase equilibria in the Ni-In-P system aids in an interpretation of bulk and thick film diffusion couples, and many of the apparent discrepancies in the literature are clarified. Finally, minor variations in the processing of the contacts (changes in the annealing gas and substrate cleaning procedure) are found in this study to have a less important role in altering the Ni/InP reactions than previous researchers have suggested.

Original language	English (US)
Pages (from-to)	393-398
Number of pages	6
Journal	Materials Research Society Symposium - Proceedings
Volume	337
DOIs	https://doi.org/10.1557/proc-337-393
State	Published - Jan 1 1994
Event	Proceedings of the 1994 MRS Spring Meeting - San Francisco, CA, USA Duration: Apr 5 1994 → Apr 8 1994

All Science Journal Classification (ASJC) codes

Materials Science(all)
Condensed Matter Physics
Mechanics of Materials
Mechanical Engineering

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10.1557/proc-337-393

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title = "Interfacial reactions and phase stability in the Ni/InP system",

abstract = "Nickel is widely used in electrical contacts to InP, especially in NiAuGe ohmic contact to n-type InP. Several researchers have even suggested that the reaction of Ni with InP plays an important role in the ohmic nature of Ni-based contacts. However, numerous discrepancies are found in the literature concerning the Ni/InP reaction. In this study, an examination of the phase equilibria in the Ni-In-P system aids in an interpretation of bulk and thick film diffusion couples, and many of the apparent discrepancies in the literature are clarified. Finally, minor variations in the processing of the contacts (changes in the annealing gas and substrate cleaning procedure) are found in this study to have a less important role in altering the Ni/InP reactions than previous researchers have suggested.",

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doi = "10.1557/proc-337-393",

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T1 - Interfacial reactions and phase stability in the Ni/InP system

AU - Mohney, Suzanne E.

AU - Chang, Y. Austin

PY - 1994/1/1

Y1 - 1994/1/1

N2 - Nickel is widely used in electrical contacts to InP, especially in NiAuGe ohmic contact to n-type InP. Several researchers have even suggested that the reaction of Ni with InP plays an important role in the ohmic nature of Ni-based contacts. However, numerous discrepancies are found in the literature concerning the Ni/InP reaction. In this study, an examination of the phase equilibria in the Ni-In-P system aids in an interpretation of bulk and thick film diffusion couples, and many of the apparent discrepancies in the literature are clarified. Finally, minor variations in the processing of the contacts (changes in the annealing gas and substrate cleaning procedure) are found in this study to have a less important role in altering the Ni/InP reactions than previous researchers have suggested.

AB - Nickel is widely used in electrical contacts to InP, especially in NiAuGe ohmic contact to n-type InP. Several researchers have even suggested that the reaction of Ni with InP plays an important role in the ohmic nature of Ni-based contacts. However, numerous discrepancies are found in the literature concerning the Ni/InP reaction. In this study, an examination of the phase equilibria in the Ni-In-P system aids in an interpretation of bulk and thick film diffusion couples, and many of the apparent discrepancies in the literature are clarified. Finally, minor variations in the processing of the contacts (changes in the annealing gas and substrate cleaning procedure) are found in this study to have a less important role in altering the Ni/InP reactions than previous researchers have suggested.

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DO - 10.1557/proc-337-393

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JO - Materials Research Society Symposium - Proceedings

JF - Materials Research Society Symposium - Proceedings

T2 - Proceedings of the 1994 MRS Spring Meeting

Y2 - 5 April 1994 through 8 April 1994

ER -

Interfacial reactions and phase stability in the Ni/InP system

Abstract

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