Interfacial reactions and phase stability in the Ni/InP system

Suzanne E. Mohney, Y. Austin Chang

Research output: Contribution to journalConference articlepeer-review

2 Scopus citations


Nickel is widely used in electrical contacts to InP, especially in NiAuGe ohmic contact to n-type InP. Several researchers have even suggested that the reaction of Ni with InP plays an important role in the ohmic nature of Ni-based contacts. However, numerous discrepancies are found in the literature concerning the Ni/InP reaction. In this study, an examination of the phase equilibria in the Ni-In-P system aids in an interpretation of bulk and thick film diffusion couples, and many of the apparent discrepancies in the literature are clarified. Finally, minor variations in the processing of the contacts (changes in the annealing gas and substrate cleaning procedure) are found in this study to have a less important role in altering the Ni/InP reactions than previous researchers have suggested.

Original languageEnglish (US)
Pages (from-to)393-398
Number of pages6
JournalMaterials Research Society Symposium - Proceedings
StatePublished - Jan 1 1994
EventProceedings of the 1994 MRS Spring Meeting - San Francisco, CA, USA
Duration: Apr 5 1994Apr 8 1994

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering


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