Keyphrases
Temperature Distribution
100%
Stress Field
100%
Heat Transfer Coefficient
100%
Volume Fraction
100%
Finite Element Model
100%
Composite Board
100%
Fiber Volume Fraction
100%
Electronic Module
100%
Custom Design
50%
Stress Distribution
50%
Metamodel
50%
Material Properties
50%
Thermally Induced
50%
Structural Damage
50%
Circuit Board
50%
Printed Circuit Board
50%
Two-layer
50%
Thin Plate
50%
High Stress
50%
Design Optimization
50%
Deformation Field
50%
Structural Failure
50%
Conjugate Heat Transfer
50%
3D CFD
50%
Thermal-structural
50%
CFD Model
50%
Temperature Gradient Field
50%
Convection Heat Transfer
50%
Rectangular Area
50%
Surface Heat Generation
50%
Orthotropic Material Properties
50%
Structural Finite Element Model
50%
Parallel Circuit
50%
Engineering
Heat Transfer Coefficient
100%
Finite Element Modeling
100%
Fiber Volume Fraction
100%
Temperature Distribution
50%
Rectangular Area
50%
Stress Field
50%
Directional
50%
Heat Generation
50%
Structural Element
50%
Computational Fluid Dynamics
50%
Structural Damage
50%
Printed Circuit Board
50%
Thin Plate
50%
Thermal Gradient
50%
Deformation Field
50%
Structural Failure
50%
Convection Heat Transfer
50%
Gradient Field
50%
Material Science
Volume Fraction
100%
Materials Property
66%
Finite Element Modeling
66%
Electronic Circuit
33%
Computational Fluid Dynamics
33%
Stress Field
33%
Structural Finite Element
33%
Orthotropic Material
33%
Chemical Engineering
Heat Transfer Coefficient
100%
Thermal Gradient
50%
Temperature Distribution
50%