TY - JOUR
T1 - Intermetallic growth between lead-free solders and palladium
AU - Sharma, Gaurav
AU - Eichfeld, C. M.
AU - Mohney, S. E.
N1 - Funding Information:
The authors are grateful to Amanda Baker for assistance with reflowing the solders, Mark Angelone (Penn State) and Dave Ackland (Lehigh University) for assistance with EPMA, and Terence J. Clark (Visteon Corporation) for his interest in this problem. The authors also acknowledge financial support from the Pennsylvania Technology Investment Authority.
Copyright:
Copyright 2018 Elsevier B.V., All rights reserved.
PY - 2003/11
Y1 - 2003/11
N2 - Intermetallic growth between Pd and the lead-free solders Sn-Ag and Sn-Ag-Cu has been studied. Diffusion couples were prepared by reflowing the solders on Pd and then aging the couples at 156°C, 175°C, 195°C, and 210°C. At the higher temperatures of 175°C, 195°C, and 210°C, PdSn4 made up most of the layer that grew between the solders and the Pd, although small regions of second phases were always found in the PdSn4 matrix, and it was sometimes possible to identify discontinuous regions of PdSn3 next to the Pd. The thickness of the intermetallic layer increased with the square root of time, consistent with diffusion-controlled growth. In couples annealed at 156°C, the morphology of the PdSn3 phase and growth kinetics differed depending on the composition of the solder.
AB - Intermetallic growth between Pd and the lead-free solders Sn-Ag and Sn-Ag-Cu has been studied. Diffusion couples were prepared by reflowing the solders on Pd and then aging the couples at 156°C, 175°C, 195°C, and 210°C. At the higher temperatures of 175°C, 195°C, and 210°C, PdSn4 made up most of the layer that grew between the solders and the Pd, although small regions of second phases were always found in the PdSn4 matrix, and it was sometimes possible to identify discontinuous regions of PdSn3 next to the Pd. The thickness of the intermetallic layer increased with the square root of time, consistent with diffusion-controlled growth. In couples annealed at 156°C, the morphology of the PdSn3 phase and growth kinetics differed depending on the composition of the solder.
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U2 - 10.1007/s11664-003-0013-6
DO - 10.1007/s11664-003-0013-6
M3 - Article
AN - SCOPUS:0347477206
SN - 0361-5235
VL - 32
SP - 1209
EP - 1213
JO - Journal of Electronic Materials
JF - Journal of Electronic Materials
IS - 11
ER -