Intermetallic growth between lead-free solders and palladium

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Intermetallic growth between Pd and the lead-free solders Sn-Ag and Sn-Ag-Cu has been studied. Diffusion couples were prepared by reflowing the solders on Pd and then aging the couples at 156°C, 175°C, 195°C, and 210°C. At the higher temperatures of 175°C, 195°C, and 210°C, PdSn4 made up most of the layer that grew between the solders and the Pd, although small regions of second phases were always found in the PdSn4 matrix, and it was sometimes possible to identify discontinuous regions of PdSn3 next to the Pd. The thickness of the intermetallic layer increased with the square root of time, consistent with diffusion-controlled growth. In couples annealed at 156°C, the morphology of the PdSn3 phase and growth kinetics differed depending on the composition of the solder.

Original languageEnglish (US)
Pages (from-to)1209-1213
Number of pages5
JournalJournal of Electronic Materials
Issue number11
StatePublished - Nov 2003

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering
  • Materials Chemistry


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