TY - GEN
T1 - Inverse Design of Embedded Inductor with Hierarchical Invertible Neural Transport Net
AU - Akinwande, Oluwaseyi
AU - Bhatti, Osama Waqar
AU - Swaminathan, Madhavan
N1 - Publisher Copyright:
© 2022 IEEE.
PY - 2022
Y1 - 2022
N2 - Heterogeneous integration of voltage regulators in power delivery networks is a growing trend that employs em-bedded inductor as a key component in significantly improving the power distribution. In this work, we propose a neural network framework called the hierarchical invertible neural transport for the inverse design of an embedded inductor. With this invertible method, we obtain the probability distributions of the parameters of the embedded inductor design space that most likely satisfy the desired specifications. We also learn the impedance response for free in the forward design. In the forward design, our results show a 2.14% normalized mean square error when compared with the output response of a full wave EM simulator.
AB - Heterogeneous integration of voltage regulators in power delivery networks is a growing trend that employs em-bedded inductor as a key component in significantly improving the power distribution. In this work, we propose a neural network framework called the hierarchical invertible neural transport for the inverse design of an embedded inductor. With this invertible method, we obtain the probability distributions of the parameters of the embedded inductor design space that most likely satisfy the desired specifications. We also learn the impedance response for free in the forward design. In the forward design, our results show a 2.14% normalized mean square error when compared with the output response of a full wave EM simulator.
UR - http://www.scopus.com/inward/record.url?scp=85143436233&partnerID=8YFLogxK
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U2 - 10.1109/EPEPS53828.2022.9947131
DO - 10.1109/EPEPS53828.2022.9947131
M3 - Conference contribution
AN - SCOPUS:85143436233
T3 - EPEPS 2022 - IEEE 31st Conference on Electrical Performance of Electronic Packaging and Systems
BT - EPEPS 2022 - IEEE 31st Conference on Electrical Performance of Electronic Packaging and Systems
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 31st IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2022
Y2 - 9 October 2022 through 12 October 2022
ER -