TY - GEN
T1 - Investigation of SILC via energy resolved spin dependent tunneling spectroscopy
AU - Ryan, J. T.
AU - Lenahan, P. M.
AU - Krishnan, A. T.
AU - Krishnan, S.
PY - 2009
Y1 - 2009
N2 - We demonstrate voltage controlled spin dependent tunneling in 1.2nm effective oxide thickness silicon oxynitride films. Our observations introduce a simple method to link point defect structure and energy levels in a very direct way in materials of great technological importance. We obtain defect energy level resolution by exploiting the enormous difference between the capacitance of the very thin dielectric and the capacitance of the depletion layer of moderately doped silicon. The simplicity of the technique and the robust character of the response make it, at least potentially, of widespread utility in the understanding of defects important in solid state electronics. Since the specific defect observed is generated by high electric field stressing, an important device instability in present day integrated circuitry, the observations are of considerable importance for present day technology.
AB - We demonstrate voltage controlled spin dependent tunneling in 1.2nm effective oxide thickness silicon oxynitride films. Our observations introduce a simple method to link point defect structure and energy levels in a very direct way in materials of great technological importance. We obtain defect energy level resolution by exploiting the enormous difference between the capacitance of the very thin dielectric and the capacitance of the depletion layer of moderately doped silicon. The simplicity of the technique and the robust character of the response make it, at least potentially, of widespread utility in the understanding of defects important in solid state electronics. Since the specific defect observed is generated by high electric field stressing, an important device instability in present day integrated circuitry, the observations are of considerable importance for present day technology.
UR - http://www.scopus.com/inward/record.url?scp=77951041919&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=77951041919&partnerID=8YFLogxK
U2 - 10.1109/IRWS.2009.5383043
DO - 10.1109/IRWS.2009.5383043
M3 - Conference contribution
AN - SCOPUS:77951041919
SN - 9781424439218
T3 - IEEE International Integrated Reliability Workshop Final Report
SP - 1
EP - 4
BT - 2009 IEEE International Integrated Reliability Workshop Final Report, IIRW 2009
T2 - 2009 IEEE International Integrated Reliability Workshop, IIRW 2009
Y2 - 18 October 2009 through 22 October 2009
ER -