I/O decoupling in high speed packages using embedded planar capacitors

Prathap Muthana; Krishna Srinivasan; Ege Engin; Madhavan Swaminathan; Rao Tummala; Daniel Amey; Karl Dietz; Sounak Banerji

doi:10.1109/ECTC.2007.373813

I/O decoupling in high speed packages using embedded planar capacitors

Prathap Muthana, Krishna Srinivasan, Ege Engin, Madhavan Swaminathan, Rao Tummala, Daniel Amey, Karl Dietz, Sounak Banerji

Electrical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

3 Scopus citations

Abstract

Embedded passives are gaining in importance due to the reduction in size of consumer electronic products. Embedded passives are gradually replacing discretes due to the miniaturization of electronic products. Integration of these passives within the package increases the real estate for active components. This would increase the functionality of the system. Among the passives, capacitors pose the biggest challenge due to the large capacitance required for decoupling high performance circuits. This paper will highlight the performance of DuPont's planar embedded capacitor laminates in organic packages to provide I/O decoupling for active circuits.

Original language	English (US)
Title of host publication	Proceedings - 57th Electronic Components and Technology Conference 2007, ECTC '07
Pages	299-304
Number of pages	6
DOIs	https://doi.org/10.1109/ECTC.2007.373813
State	Published - 2007
Event	57th Electronic Components and Technology Conference 2007, ECTC '07 - Sparks, NV, United States Duration: May 29 2007 → Jun 1 2007

Publication series

Name	Proceedings - Electronic Components and Technology Conference
ISSN (Print)	0569-5503

Conference

Conference	57th Electronic Components and Technology Conference 2007, ECTC '07
Country/Territory	United States
City	Sparks, NV
Period	5/29/07 → 6/1/07

All Science Journal Classification (ASJC) codes

Electronic, Optical and Magnetic Materials
Electrical and Electronic Engineering

Access to Document

10.1109/ECTC.2007.373813

Cite this

Muthana, P., Srinivasan, K., Engin, E., Swaminathan, M., Tummala, R., Amey, D., Dietz, K., & Banerji, S. (2007). I/O decoupling in high speed packages using embedded planar capacitors. In Proceedings - 57th Electronic Components and Technology Conference 2007, ECTC '07 (pp. 299-304). Article 4249899 (Proceedings - Electronic Components and Technology Conference). https://doi.org/10.1109/ECTC.2007.373813

@inproceedings{11fc46ef6a574024b12136f005fb6b6a,

title = "I/O decoupling in high speed packages using embedded planar capacitors",

abstract = "Embedded passives are gaining in importance due to the reduction in size of consumer electronic products. Embedded passives are gradually replacing discretes due to the miniaturization of electronic products. Integration of these passives within the package increases the real estate for active components. This would increase the functionality of the system. Among the passives, capacitors pose the biggest challenge due to the large capacitance required for decoupling high performance circuits. This paper will highlight the performance of DuPont's planar embedded capacitor laminates in organic packages to provide I/O decoupling for active circuits.",

author = "Prathap Muthana and Krishna Srinivasan and Ege Engin and Madhavan Swaminathan and Rao Tummala and Daniel Amey and Karl Dietz and Sounak Banerji",

year = "2007",

doi = "10.1109/ECTC.2007.373813",

language = "English (US)",

isbn = "1424409853",

series = "Proceedings - Electronic Components and Technology Conference",

pages = "299--304",

booktitle = "Proceedings - 57th Electronic Components and Technology Conference 2007, ECTC '07",

note = "57th Electronic Components and Technology Conference 2007, ECTC '07 ; Conference date: 29-05-2007 Through 01-06-2007",

}

Muthana, P, Srinivasan, K, Engin, E, Swaminathan, M, Tummala, R, Amey, D, Dietz, K & Banerji, S 2007, I/O decoupling in high speed packages using embedded planar capacitors. in Proceedings - 57th Electronic Components and Technology Conference 2007, ECTC '07., 4249899, Proceedings - Electronic Components and Technology Conference, pp. 299-304, 57th Electronic Components and Technology Conference 2007, ECTC '07, Sparks, NV, United States, 5/29/07. https://doi.org/10.1109/ECTC.2007.373813

I/O decoupling in high speed packages using embedded planar capacitors. / Muthana, Prathap; Srinivasan, Krishna; Engin, Ege et al.
Proceedings - 57th Electronic Components and Technology Conference 2007, ECTC '07. 2007. p. 299-304 4249899 (Proceedings - Electronic Components and Technology Conference).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

TY - GEN

T1 - I/O decoupling in high speed packages using embedded planar capacitors

AU - Muthana, Prathap

AU - Srinivasan, Krishna

AU - Engin, Ege

AU - Swaminathan, Madhavan

AU - Tummala, Rao

AU - Amey, Daniel

AU - Dietz, Karl

AU - Banerji, Sounak

PY - 2007

Y1 - 2007

N2 - Embedded passives are gaining in importance due to the reduction in size of consumer electronic products. Embedded passives are gradually replacing discretes due to the miniaturization of electronic products. Integration of these passives within the package increases the real estate for active components. This would increase the functionality of the system. Among the passives, capacitors pose the biggest challenge due to the large capacitance required for decoupling high performance circuits. This paper will highlight the performance of DuPont's planar embedded capacitor laminates in organic packages to provide I/O decoupling for active circuits.

AB - Embedded passives are gaining in importance due to the reduction in size of consumer electronic products. Embedded passives are gradually replacing discretes due to the miniaturization of electronic products. Integration of these passives within the package increases the real estate for active components. This would increase the functionality of the system. Among the passives, capacitors pose the biggest challenge due to the large capacitance required for decoupling high performance circuits. This paper will highlight the performance of DuPont's planar embedded capacitor laminates in organic packages to provide I/O decoupling for active circuits.

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M3 - Conference contribution

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SN - 9781424409853

T3 - Proceedings - Electronic Components and Technology Conference

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EP - 304

BT - Proceedings - 57th Electronic Components and Technology Conference 2007, ECTC '07

T2 - 57th Electronic Components and Technology Conference 2007, ECTC '07

Y2 - 29 May 2007 through 1 June 2007

ER -

I/O decoupling in high speed packages using embedded planar capacitors

Abstract

Publication series

Conference

All Science Journal Classification (ASJC) codes

Access to Document

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