I/O decoupling in high speed packages using embedded planar capacitors

Prathap Muthana, Krishna Srinivasan, Ege Engin, Madhavan Swaminathan, Rao Tummala, Daniel Amey, Karl Dietz, Sounak Banerji

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Scopus citations

Abstract

Embedded passives are gaining in importance due to the reduction in size of consumer electronic products. Embedded passives are gradually replacing discretes due to the miniaturization of electronic products. Integration of these passives within the package increases the real estate for active components. This would increase the functionality of the system. Among the passives, capacitors pose the biggest challenge due to the large capacitance required for decoupling high performance circuits. This paper will highlight the performance of DuPont's planar embedded capacitor laminates in organic packages to provide I/O decoupling for active circuits.

Original languageEnglish (US)
Title of host publicationProceedings - 57th Electronic Components and Technology Conference 2007, ECTC '07
Pages299-304
Number of pages6
DOIs
StatePublished - 2007
Event57th Electronic Components and Technology Conference 2007, ECTC '07 - Sparks, NV, United States
Duration: May 29 2007Jun 1 2007

Publication series

NameProceedings - Electronic Components and Technology Conference
ISSN (Print)0569-5503

Conference

Conference57th Electronic Components and Technology Conference 2007, ECTC '07
Country/TerritoryUnited States
CitySparks, NV
Period5/29/076/1/07

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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