Abstract
In this study, we report results on a piezoelectric-material-based mechanical energy-harvesting device that was fabricated by combining laser machining with microelectronics packaging technology. It was found that the laser-machining process did not have significant effect on the electrical properties of piezoelectric material. The fabricated device was tested in the low-frequency regime of 50 to 1000 Hz at constant force of 8 g (where g = 9.8m/s2). The device was found to generate continuous power of 1.13 μW at 870 Hz across a 288.5 kΩ load with a power density of 301.3 μW/cm3.
| Original language | English (US) |
|---|---|
| Article number | 4626918 |
| Pages (from-to) | 1900-1905 |
| Number of pages | 6 |
| Journal | IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control |
| Volume | 55 |
| Issue number | 9 |
| DOIs | |
| State | Published - Sep 2008 |
All Science Journal Classification (ASJC) codes
- Instrumentation
- Acoustics and Ultrasonics
- Electrical and Electronic Engineering
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