@inproceedings{d29f8817b74d498ea9f7e50f303e4eef,
title = "Lightweight diamond based composites with advanced thermal properties",
abstract = "The continuous increase of power density in electronic devices requires advanced materials with high thermal conductivity combined with a reduced coefficient of thermal expansion (CTE). For application of diamond based composites as heat sink or electronic housings in mobile applications an additional requirement is low weight. The combination of a light weight matrix material, e.g. aluminum with diamond as a filler having a high thermal conductivity but low CTE results in a material with thermal conductivities in the range of 300 to 600 W/mK combined with reduced coefficient of thermal expansion. Usually aluminum-diamond composites are reported to be prepared in literature by infiltration processes (squeeze casting or gas pressure infiltration). A PM approach was used to prepare aluminium-diamond composites. Large plates with size of 150mm×150mm were prepared and characterised with respect to the thermal diffusivity/conductivity by using a local thermal mapping technique. In addition first results of thermal analysis from PM prepared Mg-diamond composites are reported.",
author = "E. Neubauer and I. Smid and K. Cowan and H. Yu and P. Angerer",
year = "2008",
language = "English (US)",
isbn = "9781899072033",
series = "Proceedings of the Euro International Powder Metallurgy Congress and Exhibition, Euro PM 2008",
publisher = "European Powder Metallurgy Association (EPMA)",
pages = "93--98",
booktitle = "Proceedings of the Euro International Powder Metallurgy Congress and Exhibition, Euro PM 2008",
note = "European International Powder Metallurgy Congress and Exhibition, Euro PM 2008 ; Conference date: 29-09-2008 Through 01-10-2008",
}