@inproceedings{18d6ada78f17481e87e586532ba44b25,
title = "Lightweight diamond based composites with advanced thermal properties",
abstract = "The continuous increase of power density in electronic devices requires advanced materials with high thermal conductivity combined with a reduced coefficient of thermal expansion (CTE). For application of diamond based composites as heat sink or heat spreader in mobile applications an additional requirement is low weight. The combination of a light weight matrix material, e.g. aluminium with diamond as a filler having a high thermal conductivity but low CTE results in a material with thermal conductivities in the range of 300 to 600 W/mK combined with a CTE of around 9-12 ppm/K. For the preparation of this composite a PM approach is used. In addition it will be shown that this method allows the preparation of certain shapes. Problems such as machining of these composites are discussed and possible solutions will be presented.",
author = "E. Neubauer and M. Kitzmantel and I. Smid and K. Cowan and H. Yu and P. Angerer",
year = "2008",
month = dec,
day = "1",
language = "English (US)",
isbn = "0979348897",
series = "Advances in Powder Metallurgy and Particulate Materials - 2008, Proceedings of the 2008 World Congress on Powder Metallurgy and Particulate Materials, PowderMet 2008",
pages = "981--989",
booktitle = "Advances in Powder Metallurgy and Particulate Materials - 2008, Proceedings of the 2008 World Congress on Powder Metallurgy and Particulate Materials, PowderMet 2008",
note = "2008 World Congress on Powder Metallurgy and Particulate Materials, PowderMet 2008 ; Conference date: 08-06-2008 Through 12-06-2008",
}