Abstract
This paper presents for the first time the design, implementation, measurements, reliability data and integration of multiple RF components such as filters, baluns, diplexers, and a combination of the above on Liquid Crystalline Polymer (LCP) based substrates for communication standards such as 802.11 a/b/g, LMDS/MMDS, satellite/digital TV, UWB, cellular and Bluetooth type applications. These components and process technologies are being targeted as a cost-effective high-performance, miniaturized alternative to the primary technologies of choice for multi-band RF/wireless applications, namely, low-temperature co-fired ceramic (LTCC), multi-layer ceramic (MLC) and ceramic monoblock technologies. The first examples of this platform substrate technology are very compact 12mm 3 fully packaged SMT front-end filters with center frequencies of 2.45, 5.25 and 5.775 GHz. One embodiment of the filter at 2.45 GHz, which is well suited for 802.11 b/g and Bluetooth type applications, provides a passband of 100 MHz with maximum inband insertion loss less than 1.7dB at 25°C, greater than 25dB attenuation at 2700-2800 MHz, greater than 10dB attenuation below 2.2GHz, greater than 20dB rejection at the second and third harmonic and inband VSWR less than 1.5 matched to 50 Ohms at the input and output.
| Original language | English (US) |
|---|---|
| Pages (from-to) | 1866-1873 |
| Number of pages | 8 |
| Journal | Proceedings - Electronic Components and Technology Conference |
| Volume | 2 |
| State | Published - 2004 |
| Event | 2004 Proceedings - 54th Electronic Components and Technology Conference - Las Vegas, NV, United States Duration: Jun 1 2004 → Jun 4 2004 |
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering