Localized Parylene-C bonding with reactive multilayer foils

Xiaotun Qiu, Jie Zhu, Jon Oiler, Cunjiang Yu, Ziyu Wang, Hongyu Yu

Research output: Contribution to journalArticlepeer-review

22 Scopus citations


This paper describes a novel bonding technique using reactive multilayer Ni/Al foils as local heat sources to bond Parylene-C layers to another Parylene-C coating on a silicon wafer. Exothermic reactions in Ni/Al reactive multilayer foils were investigated by x-ray diffraction (XRD) and differential scanning calorimetry. XRD measurements showed that the dominant product after exothermic reaction was ordered B2 AlNi compound. The heat of reaction was calculated to be -57.9 kJ mol-1. A numerical model was developed to predict the temperature evolution in the parylene layers and silicon wafers during the bonding process. The simulation results revealed that localized heating occurred during the reactive foil joining process. Our experimental observation showed that the parylene layer was torn when the bond was forcefully broken, indicating a strong bond was achieved. Moreover, leakage test in isopropanol alcohol showed that reactive foil bonds can withstand liquid exposure. This study demonstrated the feasibility of reactive foil joining for broad applications in bio-microelectromechanical systems and microfluidic systems.

Original languageEnglish (US)
Article number185411
JournalJournal of Physics D: Applied Physics
Issue number18
StatePublished - 2009

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Acoustics and Ultrasonics
  • Surfaces, Coatings and Films


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