Low-cost diagnosis of defects in MCM substrate interconnections

Bruce C. Kim, Abhijit Chatterjee, Madhavan Swaminathan

Research output: Contribution to conferencePaperpeer-review

1 Scopus citations

Abstract

Consistent with industry needs for low-cost MCM substrate test methods, we have earlier developed a single-probe technique for detecting near-opens and near-shorts in substrate interconnects. In this paper we show how a fault-dictionary can be used to accurately determine defect location, size, etc. Such information may be used to perform repair of MCM substrates.

Original languageEnglish (US)
Pages260-265
Number of pages6
StatePublished - 1996
EventProceedings of the 1996 14th IEEE VLSI Test Symposium - Princeton, NJ, USA
Duration: Apr 28 1996May 1 1996

Conference

ConferenceProceedings of the 1996 14th IEEE VLSI Test Symposium
CityPrinceton, NJ, USA
Period4/28/965/1/96

All Science Journal Classification (ASJC) codes

  • Computer Science Applications
  • Electrical and Electronic Engineering

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