Abstract
Consistent with industry needs for low-cost MCM substrate test methods, we have earlier developed a single-probe technique for detecting near-opens and near-shorts in substrate interconnects. In this paper we show how a fault-dictionary can be used to accurately determine defect location, size, etc. Such information may be used to perform repair of MCM substrates.
Original language | English (US) |
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Pages | 260-265 |
Number of pages | 6 |
State | Published - 1996 |
Event | Proceedings of the 1996 14th IEEE VLSI Test Symposium - Princeton, NJ, USA Duration: Apr 28 1996 → May 1 1996 |
Conference
Conference | Proceedings of the 1996 14th IEEE VLSI Test Symposium |
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City | Princeton, NJ, USA |
Period | 4/28/96 → 5/1/96 |
All Science Journal Classification (ASJC) codes
- Computer Science Applications
- Electrical and Electronic Engineering