Low-cost diagnosis of defects in MCM substrate interconnections

Bruce C. Kim; Abhijit Chatterjee; Madhavan Swaminathan

Low-cost diagnosis of defects in MCM substrate interconnections

Bruce C. Kim
, Abhijit Chatterjee
, Madhavan Swaminathan

Electrical Engineering

Research output: Contribution to conference › Paper › peer-review

1 Scopus citations

Abstract

Consistent with industry needs for low-cost MCM substrate test methods, we have earlier developed a single-probe technique for detecting near-opens and near-shorts in substrate interconnects. In this paper we show how a fault-dictionary can be used to accurately determine defect location, size, etc. Such information may be used to perform repair of MCM substrates.

Original language	English (US)
Pages	260-265
Number of pages	6
State	Published - 1996
Event	Proceedings of the 1996 14th IEEE VLSI Test Symposium - Princeton, NJ, USA Duration: Apr 28 1996 → May 1 1996

Conference

Conference	Proceedings of the 1996 14th IEEE VLSI Test Symposium
City	Princeton, NJ, USA
Period	4/28/96 → 5/1/96

All Science Journal Classification (ASJC) codes

Computer Science Applications
Electrical and Electronic Engineering

Cite this

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title = "Low-cost diagnosis of defects in MCM substrate interconnections",

abstract = "Consistent with industry needs for low-cost MCM substrate test methods, we have earlier developed a single-probe technique for detecting near-opens and near-shorts in substrate interconnects. In this paper we show how a fault-dictionary can be used to accurately determine defect location, size, etc. Such information may be used to perform repair of MCM substrates.",

author = "Kim, \{Bruce C.\} and Abhijit Chatterjee and Madhavan Swaminathan",

year = "1996",

language = "English (US)",

pages = "260--265",

note = "Proceedings of the 1996 14th IEEE VLSI Test Symposium ; Conference date: 28-04-1996 Through 01-05-1996",

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TY - CONF

T1 - Low-cost diagnosis of defects in MCM substrate interconnections

AU - Kim, Bruce C.

AU - Chatterjee, Abhijit

AU - Swaminathan, Madhavan

PY - 1996

Y1 - 1996

N2 - Consistent with industry needs for low-cost MCM substrate test methods, we have earlier developed a single-probe technique for detecting near-opens and near-shorts in substrate interconnects. In this paper we show how a fault-dictionary can be used to accurately determine defect location, size, etc. Such information may be used to perform repair of MCM substrates.

AB - Consistent with industry needs for low-cost MCM substrate test methods, we have earlier developed a single-probe technique for detecting near-opens and near-shorts in substrate interconnects. In this paper we show how a fault-dictionary can be used to accurately determine defect location, size, etc. Such information may be used to perform repair of MCM substrates.

UR - https://www.scopus.com/pages/publications/0029713160

UR - https://www.scopus.com/pages/publications/0029713160#tab=citedBy

M3 - Paper

AN - SCOPUS:0029713160

SP - 260

EP - 265

T2 - Proceedings of the 1996 14th IEEE VLSI Test Symposium

Y2 - 28 April 1996 through 1 May 1996

ER -

Low-cost diagnosis of defects in MCM substrate interconnections

Abstract

Conference

All Science Journal Classification (ASJC) codes

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