Abstract
Several recent advances have been made in the development of a high electron mobility transistor (HEMT) and heterojunction bipolar transistor (HBT) in the InAs, AlSb, and GaSb material system. Research has led to the development of the technology to manufacture AlSb/InAs HEMTS on a large scale. Along with this work, improvements have been made in the device operation. The power dissipation of the AlSb/InAs HEMTs has been found to be as little as one fifth that of an InAlAs/InGaAs HEMT operating at equivalent frequencies. An HBT with a p-type InGaSb base with a 0.5 eV bandgap has recently been made. The collector and emitter are made of n-type InAlAsSb alloys. The small bandgap of the base is an important ingredient in developing an HBT that operates at low bias, and therefore low power dissipation.
Original language | English (US) |
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Pages | 191-204 |
Number of pages | 14 |
State | Published - 2004 |
Event | State-of-the-Art Program on Compound Semiconductors XL (SOTAPOCS XL) and Narrow Bandgap Optoelectronic Materials and Devices II - Proceedings of the International Symposium - San Antonio, TX, United States Duration: May 9 2004 → May 14 2004 |
Other
Other | State-of-the-Art Program on Compound Semiconductors XL (SOTAPOCS XL) and Narrow Bandgap Optoelectronic Materials and Devices II - Proceedings of the International Symposium |
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Country/Territory | United States |
City | San Antonio, TX |
Period | 5/9/04 → 5/14/04 |
All Science Journal Classification (ASJC) codes
- Engineering(all)