Emerging artificial intelligence (AI) applications require dense connectivity between integrated circuit (IC) chips to enable high-speed computations. Heterogeneous integration (HI) using advanced packaging is being viewed as a critical enabling technology for supporting AI applications. Such highly integrated systems require a multitude of materials to support electrical, mechanical, thermal, and chemical properties. In addition, these materials need to be compatible with packaging processes to ensure compatibility with low-cost manufacturing solutions. The inter-play between the various engineering domains makes the selection of materials, their processability, and compatibility extremely complex. In this article, we investigate the future in terms of the requirements posed by materials for HI and survey the past and present work in this area. Graphic abstract: [Figure not available: see fulltext.].
All Science Journal Classification (ASJC) codes
- Materials Science(all)
- Condensed Matter Physics
- Physical and Theoretical Chemistry