Materials Research Society Symposium - Proceedings: Preface

P. Muralt, Y. S. Cho, M. Klee, Jon-Paul Maria, Clive A. Randall, Ch Hoffmann

Research output: Contribution to journal › Conference article › peer-review

Original language	English (US)
Journal	Materials Research Society Symposium - Proceedings
Volume	783
State	Published - Dec 1 2003
Event	Materials, Integration and Packaging Issues for High - Frequency Devices - Boston, MA, United States Duration: Dec 1 2003 → Dec 3 2003

All Science Journal Classification (ASJC) codes

@article{a088af4f0f264909a9c716f2c51b199d,

title = "Materials Research Society Symposium - Proceedings: Preface",

author = "P. Muralt and Cho, {Y. S.} and M. Klee and Jon-Paul Maria and Randall, {Clive A.} and Ch Hoffmann",

year = "2003",

month = dec,

day = "1",

language = "English (US)",

volume = "783",

journal = "Materials Research Society Symposium - Proceedings",

issn = "0272-9172",

publisher = "Materials Research Society",

note = "Materials, Integration and Packaging Issues for High - Frequency Devices ; Conference date: 01-12-2003 Through 03-12-2003",

}

TY - JOUR

T1 - Materials Research Society Symposium - Proceedings

T2 - Materials, Integration and Packaging Issues for High - Frequency Devices

AU - Muralt, P.

AU - Cho, Y. S.

AU - Klee, M.

AU - Maria, Jon-Paul

AU - Randall, Clive A.

AU - Hoffmann, Ch

PY - 2003/12/1

Y1 - 2003/12/1

UR - http://www.scopus.com/inward/record.url?scp=3042536596&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=3042536596&partnerID=8YFLogxK

M3 - Conference article

AN - SCOPUS:3042536596

SN - 0272-9172

VL - 783

JO - Materials Research Society Symposium - Proceedings

JF - Materials Research Society Symposium - Proceedings

Y2 - 1 December 2003 through 3 December 2003

ER -