Materials Research Society Symposium Proceedings: Preface

Yong S. Cho, Don Shiffler, Clive A. Randall, Harrie A.C. Tilmans, Takaaki Tsurumi

Research output: Contribution to journal › Conference article › peer-review

Original language	English (US)
Pages (from-to)	xi
Journal	Materials Research Society Symposium Proceedings
Volume	833
State	Published - 2005
Event	Materials, Intergration and Packaging Issues for High-Frequency Devices II - Boston, MA, United States Duration: Nov 29 2004 → Dec 1 2004

All Science Journal Classification (ASJC) codes

@article{65aa6d50a4e444478cbcf56413cf5ccb,

title = "Materials Research Society Symposium Proceedings: Preface",

author = "Cho, {Yong S.} and Don Shiffler and Randall, {Clive A.} and Tilmans, {Harrie A.C.} and Takaaki Tsurumi",

year = "2005",

language = "English (US)",

volume = "833",

pages = "xi",

journal = "Materials Research Society Symposium Proceedings",

issn = "0272-9172",

publisher = "Materials Research Society",

note = "Materials, Intergration and Packaging Issues for High-Frequency Devices II ; Conference date: 29-11-2004 Through 01-12-2004",

}

TY - JOUR

T1 - Materials Research Society Symposium Proceedings

T2 - Materials, Intergration and Packaging Issues for High-Frequency Devices II

AU - Cho, Yong S.

AU - Shiffler, Don

AU - Randall, Clive A.

AU - Tilmans, Harrie A.C.

AU - Tsurumi, Takaaki

PY - 2005

Y1 - 2005

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UR - http://www.scopus.com/inward/citedby.url?scp=20344371209&partnerID=8YFLogxK

M3 - Conference article

AN - SCOPUS:20344371209

SN - 0272-9172

VL - 833

SP - xi

JO - Materials Research Society Symposium Proceedings

JF - Materials Research Society Symposium Proceedings

Y2 - 29 November 2004 through 1 December 2004

ER -