Measurement and simulation of interdigital capacitor structures with high-permittivity thin films

Clinton P. Scarborough, Steve Perini, Jeremy Accord, Joshua Robinson, George Semouchkin, Michael Lanagan

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Electromagnetic simulation was found to show promise as a method to measure the properties of a thin film with an interdigital capacitor (IDC) constructed on it. Given a film permittivity as measured by the split-cavity resonator technique, IDC simulations were adjusted until the simulated results approached those measured from the physical sample. The difference between the measured and simulated capacitance was reduced to about 5% over the frequency range of interest. With the knowledge of the effects of different simulation parameters, the properties of the simulated film can be adjusted until the simulation results match the measured results, and the properties of the measured film can be inferred to match the design parameters of the simulated film. The method is a general technique that may be applied to microwave dielectric characterization of thin films, thick films and bulk ceramics, and it is particularly useful for submicron films with high permittivity.

Original languageEnglish (US)
Title of host publication5th IMAPS/ACerS International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies 2009, CICMT 2009
Pages212-215
Number of pages4
StatePublished - 2009
Event5th International Conference on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2009 - Denver, CO, United States
Duration: Apr 21 2009Apr 23 2009

Publication series

Name5th IMAPS/ACerS International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies 2009, CICMT 2009

Other

Other5th International Conference on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2009
Country/TerritoryUnited States
CityDenver, CO
Period4/21/094/23/09

All Science Journal Classification (ASJC) codes

  • Hardware and Architecture
  • Ceramics and Composites

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