TY - GEN
T1 - Measurement and simulation of interdigital capacitor structures with high-permittivity thin films
AU - Scarborough, Clinton P.
AU - Perini, Steve
AU - Accord, Jeremy
AU - Robinson, Joshua
AU - Semouchkin, George
AU - Lanagan, Michael
PY - 2009
Y1 - 2009
N2 - Electromagnetic simulation was found to show promise as a method to measure the properties of a thin film with an interdigital capacitor (IDC) constructed on it. Given a film permittivity as measured by the split-cavity resonator technique, IDC simulations were adjusted until the simulated results approached those measured from the physical sample. The difference between the measured and simulated capacitance was reduced to about 5% over the frequency range of interest. With the knowledge of the effects of different simulation parameters, the properties of the simulated film can be adjusted until the simulation results match the measured results, and the properties of the measured film can be inferred to match the design parameters of the simulated film. The method is a general technique that may be applied to microwave dielectric characterization of thin films, thick films and bulk ceramics, and it is particularly useful for submicron films with high permittivity.
AB - Electromagnetic simulation was found to show promise as a method to measure the properties of a thin film with an interdigital capacitor (IDC) constructed on it. Given a film permittivity as measured by the split-cavity resonator technique, IDC simulations were adjusted until the simulated results approached those measured from the physical sample. The difference between the measured and simulated capacitance was reduced to about 5% over the frequency range of interest. With the knowledge of the effects of different simulation parameters, the properties of the simulated film can be adjusted until the simulation results match the measured results, and the properties of the measured film can be inferred to match the design parameters of the simulated film. The method is a general technique that may be applied to microwave dielectric characterization of thin films, thick films and bulk ceramics, and it is particularly useful for submicron films with high permittivity.
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M3 - Conference contribution
AN - SCOPUS:84879846616
SN - 9781615673742
T3 - 5th IMAPS/ACerS International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies 2009, CICMT 2009
SP - 212
EP - 215
BT - 5th IMAPS/ACerS International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies 2009, CICMT 2009
T2 - 5th International Conference on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2009
Y2 - 21 April 2009 through 23 April 2009
ER -