Abstract
The measured dielectric anisotropy of BPDA-PDA polyimide, obtained from a specially designed test vehicle, is presented. The multilayer thin-film structure is representative of its actual use in multichip carrier (MCMD) applications both from the cross sectional dimensions and fabrication sequence point of view. Modeling is performed using finite-element and electromagnetic techniques and the effect of anisotropy on signal propagation and crosstalk are verified through time-domain measurements.
| Original language | English (US) |
|---|---|
| Pages (from-to) | 486-492 |
| Number of pages | 7 |
| Journal | IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging |
| Volume | 17 |
| Issue number | 4 |
| DOIs | |
| State | Published - Nov 1994 |
All Science Journal Classification (ASJC) codes
- General Engineering
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