Abstract
Transfer printing technology provides a versatile method for the fabrication and large-scale assembly of inorganic flexible and stretchable electronics by the precise assembly of functional materials at micro- and nanometer scales into spatial functional devices with two-dimensional or three-dimensional layouts. Optimal designs of the stamp based on mechanics theory, novel structures, and material science play a key role in the development of transfer printing technologies with high efficiency. In this chapter, working principles of transfer printing for modulating the interface adhesion strength based on mechanics, structure, and material science are comprehensively introduced, followed by several representative transfer printing methods. The established analytical mechanical models for characterizing the interfacial adhesion strength, novel structures, and functional materials for achieving a large change in the interface contact area and adhesion strength are summarized. This chapter allows us to fully understand the mechanics, structure, and material science involved in transfer printing technology and provides a basis for the future development of transfer printing technology.
Original language | English (US) |
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Title of host publication | Transfer Printing Technologies and Applications |
Publisher | Elsevier |
Pages | 3-36 |
Number of pages | 34 |
ISBN (Electronic) | 9780443188459 |
ISBN (Print) | 9780443188442 |
DOIs | |
State | Published - Jan 1 2024 |
All Science Journal Classification (ASJC) codes
- General Physics and Astronomy