Abstract
Atomistic simulations of radiation damage uncover how grain boundaries (GBs) migrate and coalesce under irradiation in bicrystalline Cu. Planar GB migration biased by defect cluster-mediated attraction first leads to slow and steady motion. Subsequently, adjoining GBs coalesce into curved surfaces, where curvature-driven migration with a velocity three orders of magnitude higher than that of a planar boundary dominates motion, triggering rapid grain growth. This study reveals the atomistic mechanisms of radiation-induced grain growth, and has practical implications towards engineering radiation-tolerant nanostructures.
Original language | English (US) |
---|---|
Pages (from-to) | 66-70 |
Number of pages | 5 |
Journal | Scripta Materialia |
Volume | 163 |
DOIs | |
State | Published - Apr 1 2019 |
All Science Journal Classification (ASJC) codes
- General Materials Science
- Condensed Matter Physics
- Mechanics of Materials
- Mechanical Engineering
- Metals and Alloys