Metallization of a polymer substrate for microfluidic-cooled RF laminates

Stephen Long; W. Mark Dorsey; André A. Adams; Greg Huff

doi:10.1109/ICICDT.2014.6838591

Metallization of a polymer substrate for microfluidic-cooled RF laminates

Stephen Long, W. Mark Dorsey, André A. Adams, Greg Huff

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

A new method for metallization of a polymer substrate has been demonstrated. This method allows for RF devices, including integrated circuits, to be fabricated on substrates which may feature microfluidic channels for cooling. Conventional hot-embossing was used to integrate copper mesh into a poly(methyl methacrylate) (PMMA), forming a microwave laminate. The laminate was machined into a microstrip patch antenna with a resonant frequency of 2.916 GHz.

Original language	English (US)
Title of host publication	ICICDT 2014 - IEEE International Conference on Integrated Circuit Design and Technology
Publisher	IEEE Computer Society
ISBN (Print)	9781479921539
DOIs	https://doi.org/10.1109/ICICDT.2014.6838591
State	Published - 2014
Event	2014 IEEE International Conference on Integrated Circuit Design and Technology, ICICDT 2014 - Austin, TX, United States Duration: May 28 2014 → May 30 2014

Publication series

Name	ICICDT 2014 - IEEE International Conference on Integrated Circuit Design and Technology

Conference

Conference	2014 IEEE International Conference on Integrated Circuit Design and Technology, ICICDT 2014
Country/Territory	United States
City	Austin, TX
Period	5/28/14 → 5/30/14

All Science Journal Classification (ASJC) codes

Hardware and Architecture
Electrical and Electronic Engineering

Access to Document

10.1109/ICICDT.2014.6838591

Cite this

Long, S., Dorsey, W. M., Adams, A. A., & Huff, G. (2014). Metallization of a polymer substrate for microfluidic-cooled RF laminates. In ICICDT 2014 - IEEE International Conference on Integrated Circuit Design and Technology Article 6838591 (ICICDT 2014 - IEEE International Conference on Integrated Circuit Design and Technology). IEEE Computer Society. https://doi.org/10.1109/ICICDT.2014.6838591

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title = "Metallization of a polymer substrate for microfluidic-cooled RF laminates",

abstract = "A new method for metallization of a polymer substrate has been demonstrated. This method allows for RF devices, including integrated circuits, to be fabricated on substrates which may feature microfluidic channels for cooling. Conventional hot-embossing was used to integrate copper mesh into a poly(methyl methacrylate) (PMMA), forming a microwave laminate. The laminate was machined into a microstrip patch antenna with a resonant frequency of 2.916 GHz.",

author = "Stephen Long and Dorsey, {W. Mark} and Adams, {Andr{\'e} A.} and Greg Huff",

year = "2014",

doi = "10.1109/ICICDT.2014.6838591",

language = "English (US)",

isbn = "9781479921539",

series = "ICICDT 2014 - IEEE International Conference on Integrated Circuit Design and Technology",

publisher = "IEEE Computer Society",

booktitle = "ICICDT 2014 - IEEE International Conference on Integrated Circuit Design and Technology",

address = "United States",

note = "2014 IEEE International Conference on Integrated Circuit Design and Technology, ICICDT 2014 ; Conference date: 28-05-2014 Through 30-05-2014",

}

Long, S, Dorsey, WM, Adams, AA & Huff, G 2014, Metallization of a polymer substrate for microfluidic-cooled RF laminates. in ICICDT 2014 - IEEE International Conference on Integrated Circuit Design and Technology., 6838591, ICICDT 2014 - IEEE International Conference on Integrated Circuit Design and Technology, IEEE Computer Society, 2014 IEEE International Conference on Integrated Circuit Design and Technology, ICICDT 2014, Austin, TX, United States, 5/28/14. https://doi.org/10.1109/ICICDT.2014.6838591

Metallization of a polymer substrate for microfluidic-cooled RF laminates. / Long, Stephen; Dorsey, W. Mark; Adams, André A. et al.
ICICDT 2014 - IEEE International Conference on Integrated Circuit Design and Technology. IEEE Computer Society, 2014. 6838591 (ICICDT 2014 - IEEE International Conference on Integrated Circuit Design and Technology).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

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AU - Adams, André A.

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AB - A new method for metallization of a polymer substrate has been demonstrated. This method allows for RF devices, including integrated circuits, to be fabricated on substrates which may feature microfluidic channels for cooling. Conventional hot-embossing was used to integrate copper mesh into a poly(methyl methacrylate) (PMMA), forming a microwave laminate. The laminate was machined into a microstrip patch antenna with a resonant frequency of 2.916 GHz.

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PB - IEEE Computer Society

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Y2 - 28 May 2014 through 30 May 2014

ER -

Metallization of a polymer substrate for microfluidic-cooled RF laminates

Abstract

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All Science Journal Classification (ASJC) codes

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