Method for predicting microsegregation-free solidification with application to Ag-Cu alloys

E. Y. Yankov; M. I. Yankova; S. M. Copley; Judith Todd Copley

doi:10.1063/1.106094

Method for predicting microsegregation-free solidification with application to Ag-Cu alloys

E. Y. Yankov
, M. I. Yankova
, S. M. Copley
, Judith Todd Copley

Engineering Science and Mechanics

Research output: Contribution to journal › Article › peer-review

1 Scopus citations

Abstract

Melting the surface of Ag-Cu specimens with a laser or electron beam produces a variety of microstructures, the most interesting being a banded structure. In this letter we present a method, based on the interface response functions for solidification developed by Aziz and Kaplan [Acta Metall. 36, 2335 (1988)], for calculating the scanning velocity of the beam needed to bypass the banded structure and solidify the alloy in a microsegregation-free manner. When this velocity has been determined experimentally, as in the present Ag-Cu system, the width of the solid-liquid interface can be estimated.

Original language	English (US)
Pages (from-to)	2106-2108
Number of pages	3
Journal	Applied Physics Letters
Volume	59
Issue number	17
DOIs	https://doi.org/10.1063/1.106094
State	Published - Dec 1 1991

All Science Journal Classification (ASJC) codes

Physics and Astronomy (miscellaneous)

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10.1063/1.106094

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title = "Method for predicting microsegregation-free solidification with application to Ag-Cu alloys",

abstract = "Melting the surface of Ag-Cu specimens with a laser or electron beam produces a variety of microstructures, the most interesting being a banded structure. In this letter we present a method, based on the interface response functions for solidification developed by Aziz and Kaplan [Acta Metall. 36, 2335 (1988)], for calculating the scanning velocity of the beam needed to bypass the banded structure and solidify the alloy in a microsegregation-free manner. When this velocity has been determined experimentally, as in the present Ag-Cu system, the width of the solid-liquid interface can be estimated.",

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AU - Yankov, E. Y.

AU - Yankova, M. I.

AU - Copley, S. M.

AU - Todd Copley, Judith

PY - 1991/12/1

Y1 - 1991/12/1

N2 - Melting the surface of Ag-Cu specimens with a laser or electron beam produces a variety of microstructures, the most interesting being a banded structure. In this letter we present a method, based on the interface response functions for solidification developed by Aziz and Kaplan [Acta Metall. 36, 2335 (1988)], for calculating the scanning velocity of the beam needed to bypass the banded structure and solidify the alloy in a microsegregation-free manner. When this velocity has been determined experimentally, as in the present Ag-Cu system, the width of the solid-liquid interface can be estimated.

AB - Melting the surface of Ag-Cu specimens with a laser or electron beam produces a variety of microstructures, the most interesting being a banded structure. In this letter we present a method, based on the interface response functions for solidification developed by Aziz and Kaplan [Acta Metall. 36, 2335 (1988)], for calculating the scanning velocity of the beam needed to bypass the banded structure and solidify the alloy in a microsegregation-free manner. When this velocity has been determined experimentally, as in the present Ag-Cu system, the width of the solid-liquid interface can be estimated.

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UR - https://www.scopus.com/pages/publications/33646033943#tab=citedBy

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JO - Applied Physics Letters

JF - Applied Physics Letters

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ER -

Method for predicting microsegregation-free solidification with application to Ag-Cu alloys

Abstract

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