TY - JOUR
T1 - Microfabricated Testbench for High Throughput Measurement of Thermal and Thermoelectric Properties of Low-Dimensional Materials
AU - Kim, Duk Soo
AU - Kally, James
AU - Samarth, Nitin
AU - Tadigadapa, Srinivas
N1 - Publisher Copyright:
© 2017 IEEE.
PY - 2017/4
Y1 - 2017/4
N2 - We have developed a microfabricated testbench to measure the electrical, thermal, and thermoelectric properties of low-dimensional materials. In this unique design, a number of platform tips (test benches) are gathered in the central area of the chip for increased probability of positioning a bottom-up synthesized single nanomaterial structure across two platform tips when such materials are drop cast from a solution. Each platform has an embedded heater to heat the platform tip and a thermocouple to accurately measure its temperature. Electrically isolated from the thermocouple and heater structure, a top layer platinum on each platform is used to electrically connect to the low-dimensional material. Electrical conductivity, thermal conductivity, Seebeck coefficient, and ZT of GaAs/MnAs core/shell nanowires were successfully measured using testbench in the temperature range of 25 to 300 K.
AB - We have developed a microfabricated testbench to measure the electrical, thermal, and thermoelectric properties of low-dimensional materials. In this unique design, a number of platform tips (test benches) are gathered in the central area of the chip for increased probability of positioning a bottom-up synthesized single nanomaterial structure across two platform tips when such materials are drop cast from a solution. Each platform has an embedded heater to heat the platform tip and a thermocouple to accurately measure its temperature. Electrically isolated from the thermocouple and heater structure, a top layer platinum on each platform is used to electrically connect to the low-dimensional material. Electrical conductivity, thermal conductivity, Seebeck coefficient, and ZT of GaAs/MnAs core/shell nanowires were successfully measured using testbench in the temperature range of 25 to 300 K.
UR - https://www.scopus.com/pages/publications/85009967923
UR - https://www.scopus.com/inward/citedby.url?scp=85009967923&partnerID=8YFLogxK
U2 - 10.1109/JMEMS.2016.2646799
DO - 10.1109/JMEMS.2016.2646799
M3 - Article
AN - SCOPUS:85009967923
SN - 1057-7157
VL - 26
SP - 396
EP - 405
JO - Journal of Microelectromechanical Systems
JF - Journal of Microelectromechanical Systems
IS - 2
M1 - 7820139
ER -