Microsample tensile testing of nanocrystalline copper

Y. M. Wang; K. Wang; D. Pan; K. Lu; K. J. Hemker; E. Ma

doi:10.1016/S1359-6462(03)00159-3

Microsample tensile testing of nanocrystalline copper

Y. M. Wang, K. Wang, D. Pan, K. Lu, K. J. Hemker, E. Ma

Materials Characterization Lab

Research output: Contribution to journal › Article › peer-review

241 Scopus citations

Abstract

The tensile properties of nanocrystalline copper with grain sizes <100 nm produced by surface mechanical attrition treatment have been characterized using a microsample testing technique. The nanocrystalline copper exhibits a yield strength as high as 760 MPa, with a small elongation to failure. Factors leading to the high strength and low ductility are discussed.

Original language	English (US)
Pages (from-to)	1581-1586
Number of pages	6
Journal	Scripta Materialia
Volume	48
Issue number	12
DOIs	https://doi.org/10.1016/S1359-6462(03)00159-3
State	Published - Jun 2003

All Science Journal Classification (ASJC) codes

General Materials Science
Condensed Matter Physics
Mechanics of Materials
Mechanical Engineering
Metals and Alloys

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10.1016/S1359-6462(03)00159-3

Cite this

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title = "Microsample tensile testing of nanocrystalline copper",

abstract = "The tensile properties of nanocrystalline copper with grain sizes <100 nm produced by surface mechanical attrition treatment have been characterized using a microsample testing technique. The nanocrystalline copper exhibits a yield strength as high as 760 MPa, with a small elongation to failure. Factors leading to the high strength and low ductility are discussed.",

author = "Wang, {Y. M.} and K. Wang and D. Pan and K. Lu and Hemker, {K. J.} and E. Ma",

note = "Funding Information: The authors thank Prof. F. Ebrahimi and Dr. Dezhi Zhang for helpful discussions, and Prof. Jian Lu for sharing with us his unpublished measurement and modeling data for residual stresses. The financial support was provided by US National Science Foundation (grant no. DMR-0210215).",

year = "2003",

month = jun,

doi = "10.1016/S1359-6462(03)00159-3",

language = "English (US)",

volume = "48",

pages = "1581--1586",

journal = "Scripta Materialia",

issn = "1359-6462",

publisher = "Acta Materialia Inc",

number = "12",

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TY - JOUR

T1 - Microsample tensile testing of nanocrystalline copper

AU - Wang, Y. M.

AU - Wang, K.

AU - Pan, D.

AU - Lu, K.

AU - Hemker, K. J.

AU - Ma, E.

N1 - Funding Information: The authors thank Prof. F. Ebrahimi and Dr. Dezhi Zhang for helpful discussions, and Prof. Jian Lu for sharing with us his unpublished measurement and modeling data for residual stresses. The financial support was provided by US National Science Foundation (grant no. DMR-0210215).

PY - 2003/6

Y1 - 2003/6

N2 - The tensile properties of nanocrystalline copper with grain sizes <100 nm produced by surface mechanical attrition treatment have been characterized using a microsample testing technique. The nanocrystalline copper exhibits a yield strength as high as 760 MPa, with a small elongation to failure. Factors leading to the high strength and low ductility are discussed.

AB - The tensile properties of nanocrystalline copper with grain sizes <100 nm produced by surface mechanical attrition treatment have been characterized using a microsample testing technique. The nanocrystalline copper exhibits a yield strength as high as 760 MPa, with a small elongation to failure. Factors leading to the high strength and low ductility are discussed.

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UR - http://www.scopus.com/inward/citedby.url?scp=0344942500&partnerID=8YFLogxK

U2 - 10.1016/S1359-6462(03)00159-3

DO - 10.1016/S1359-6462(03)00159-3

M3 - Article

AN - SCOPUS:0344942500

SN - 1359-6462

VL - 48

SP - 1581

EP - 1586

JO - Scripta Materialia

JF - Scripta Materialia

IS - 12

ER -

Microsample tensile testing of nanocrystalline copper

Abstract

All Science Journal Classification (ASJC) codes

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