Microwave design & characterization of a novel nano-Cu based ultra-fine pitch chip-to-package interconnect

Tapobrata Bandyopadhyay; Gaurav Mehrotra; Mahadevan K. Iyer; P. M. Raj; Madhavan Swaminathan; Rao R. Tummala

doi:10.1109/ECTC.2008.4550134

Microwave design & characterization of a novel nano-Cu based ultra-fine pitch chip-to-package interconnect

Tapobrata Bandyopadhyay
, Gaurav Mehrotra
, Mahadevan K. Iyer
, P. M. Raj
, Madhavan Swaminathan
, Rao R. Tummala

Electrical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

This paper presents design and characterization of Nano-Cu based ultra-fine pitch chip-to-package interconnects for microwave frequencies. Transitions are designed with this new interconnect and characterized upto 40 GHz in Packaging configurations such as Chip-on-Chip and Chip-on-Package.

Original language	English (US)
Title of host publication	2008 Proceedings 58th Electronic Components and Technology Conference, ECTC
Pages	1242-1248
Number of pages	7
DOIs	https://doi.org/10.1109/ECTC.2008.4550134
State	Published - 2008
Event	2008 58th Electronic Components and Technology Conference, ECTC - Lake Buena Vista, FL, United States Duration: May 27 2008 → May 30 2008

Publication series

Name	Proceedings - Electronic Components and Technology Conference
ISSN (Print)	0569-5503

Conference

Conference	2008 58th Electronic Components and Technology Conference, ECTC
Country/Territory	United States
City	Lake Buena Vista, FL
Period	5/27/08 → 5/30/08

All Science Journal Classification (ASJC) codes

Electronic, Optical and Magnetic Materials
Electrical and Electronic Engineering

Access to Document

10.1109/ECTC.2008.4550134

Cite this

Bandyopadhyay, T., Mehrotra, G., Iyer, M. K., Raj, P. M., Swaminathan, M., & Tummala, R. R. (2008). Microwave design & characterization of a novel nano-Cu based ultra-fine pitch chip-to-package interconnect. In 2008 Proceedings 58th Electronic Components and Technology Conference, ECTC (pp. 1242-1248). Article 4550134 (Proceedings - Electronic Components and Technology Conference). https://doi.org/10.1109/ECTC.2008.4550134

@inproceedings{5f8b24ef316d4250afc7f3d5796decbe,

title = "Microwave design \& characterization of a novel nano-Cu based ultra-fine pitch chip-to-package interconnect",

abstract = "This paper presents design and characterization of Nano-Cu based ultra-fine pitch chip-to-package interconnects for microwave frequencies. Transitions are designed with this new interconnect and characterized upto 40 GHz in Packaging configurations such as Chip-on-Chip and Chip-on-Package.",

author = "Tapobrata Bandyopadhyay and Gaurav Mehrotra and Iyer, \{Mahadevan K.\} and Raj, \{P. M.\} and Madhavan Swaminathan and Tummala, \{Rao R.\}",

year = "2008",

doi = "10.1109/ECTC.2008.4550134",

language = "English (US)",

isbn = "9781424422302",

series = "Proceedings - Electronic Components and Technology Conference",

pages = "1242--1248",

booktitle = "2008 Proceedings 58th Electronic Components and Technology Conference, ECTC",

note = "2008 58th Electronic Components and Technology Conference, ECTC ; Conference date: 27-05-2008 Through 30-05-2008",

}

Bandyopadhyay, T, Mehrotra, G, Iyer, MK, Raj, PM, Swaminathan, M & Tummala, RR 2008, Microwave design & characterization of a novel nano-Cu based ultra-fine pitch chip-to-package interconnect. in 2008 Proceedings 58th Electronic Components and Technology Conference, ECTC., 4550134, Proceedings - Electronic Components and Technology Conference, pp. 1242-1248, 2008 58th Electronic Components and Technology Conference, ECTC, Lake Buena Vista, FL, United States, 5/27/08. https://doi.org/10.1109/ECTC.2008.4550134

Microwave design & characterization of a novel nano-Cu based ultra-fine pitch chip-to-package interconnect. / Bandyopadhyay, Tapobrata; Mehrotra, Gaurav; Iyer, Mahadevan K. et al.
2008 Proceedings 58th Electronic Components and Technology Conference, ECTC. 2008. p. 1242-1248 4550134 (Proceedings - Electronic Components and Technology Conference).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

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T1 - Microwave design & characterization of a novel nano-Cu based ultra-fine pitch chip-to-package interconnect

AU - Bandyopadhyay, Tapobrata

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AU - Raj, P. M.

AU - Swaminathan, Madhavan

AU - Tummala, Rao R.

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AB - This paper presents design and characterization of Nano-Cu based ultra-fine pitch chip-to-package interconnects for microwave frequencies. Transitions are designed with this new interconnect and characterized upto 40 GHz in Packaging configurations such as Chip-on-Chip and Chip-on-Package.

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T3 - Proceedings - Electronic Components and Technology Conference

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Bandyopadhyay T, Mehrotra G, Iyer MK, Raj PM, Swaminathan M, Tummala RR. Microwave design & characterization of a novel nano-Cu based ultra-fine pitch chip-to-package interconnect. In 2008 Proceedings 58th Electronic Components and Technology Conference, ECTC. 2008. p. 1242-1248. 4550134. (Proceedings - Electronic Components and Technology Conference). doi: 10.1109/ECTC.2008.4550134

Microwave design & characterization of a novel nano-Cu based ultra-fine pitch chip-to-package interconnect

Abstract

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All Science Journal Classification (ASJC) codes

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