TY - GEN
T1 - Mid frequency decoupling using embedded decoupling capacitors
AU - Muthana, Prathap
AU - Swaminathan, Madhavan
AU - Engin, Ege
AU - Markondeya Raj, P.
AU - Tummala, Rao
PY - 2005
Y1 - 2005
N2 - Surface Mount Technology (SMT) decoupling capacitors fail to provide decoupling above 100MHz. This paper presents the use of embedded thin film capacitors to provide decoupling in the mid frequency range from 100MHz to 2GHz. On-chip capacitance provides decoupling above 2GHz. The effect of chip, package and board capacitors on the performance of digital systems is analyzed taking into account the parasitic effects of power/ground planes, vias and solder balls. A synthesis and selection methodology for embedded package capacitors is also presented.
AB - Surface Mount Technology (SMT) decoupling capacitors fail to provide decoupling above 100MHz. This paper presents the use of embedded thin film capacitors to provide decoupling in the mid frequency range from 100MHz to 2GHz. On-chip capacitance provides decoupling above 2GHz. The effect of chip, package and board capacitors on the performance of digital systems is analyzed taking into account the parasitic effects of power/ground planes, vias and solder balls. A synthesis and selection methodology for embedded package capacitors is also presented.
UR - http://www.scopus.com/inward/record.url?scp=33845593084&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=33845593084&partnerID=8YFLogxK
U2 - 10.1109/EPEP.2005.1563756
DO - 10.1109/EPEP.2005.1563756
M3 - Conference contribution
AN - SCOPUS:33845593084
SN - 0780392205
SN - 9780780392205
T3 - IEEE Topical Meeting on Electrical Performance of Electronic Packaging
SP - 271
EP - 274
BT - 14th Topical Meeting on Electrical Performance of Electronic Packaging 2005
T2 - 14th Topical Meeting on Electrical Performance of Electronic Packaging 2005
Y2 - 24 October 2005 through 26 October 2005
ER -